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ADXL355BEZ

Accelerometer Triple 2.048g/4.096g/8.192g 3.3V 14-Pin CLLCC Tray

Manufacturer

ANALOG DEVICES

Mrf. Part #

ADXL355BEZ

Package

Key Attributes

Datasheet

Products Specifications

Analog Devices ADXL355BEZ 3‑Axis Digital Accelerometer (±2.048/±4.096/±8.192 g) in 14‑CLLCC

The Analog Devices ADXL355BEZ is a precision, low noise, low drift 3‑axis digital MEMS accelerometer built for demanding industrial and instrumentation applications. Part of the ADXL355 series, the ADXL355BEZ combines selectable full‑scale ranges of ±2.048 g, ±4.096 g, and ±8.192 g with a robust ceramic leadless package, digital output (SPI and I²C), and a nominal 3.3 V supply. Its stability over temperature and low noise characteristics make it a strong fit for vibration monitoring, structural health monitoring, precision tilt, and platform stabilization.

Engineers and sourcing teams value the ADXL355BEZ for its blend of performance and manufacturability: a compact 14‑pin CLLCC surface‑mount package, RoHS/REACH compliance, and an active lifecycle designation from Analog Devices. This article summarizes the essential specifications, integration notes, applications, lifecycle and compliance details, and commonly asked questions to streamline design and procurement.

Key Features and Value Highlights

  • 3‑axis digital MEMS accelerometer (X, Y, Z)
  • Selectable full‑scale ranges: ±2.048 g, ±4.096 g, ±8.192 g
  • Digital interfaces: SPI and I²C
  • Low noise, low drift architecture (family characteristic)
  • 3.3 V nominal supply
  • 14‑pin ceramic leadless chip carrier (CLLCC), surface‑mount
  • RoHS and REACH compliant
  • Active lifecycle status (per Analog Devices product page)

These attributes position the ADXL355BEZ for precision motion sensing where repeatability, temperature stability, and straightforward digital integration are critical.

At a Glance: What Sets ADXL355BEZ Apart

  • Consistent digital readout across ranges helps simplify firmware frameworks for multi‑range deployments.
  • Ceramic leadless package enhances mechanical robustness and thermal stability versus common plastic packages.
  • Dual‑bus connectivity (SPI or I²C) gives system designers flexibility in MCU/SoC selection and board resource allocation.

Specifications

The following specs are compiled from the provided product information and official Analog Devices resources. If a parameter is not listed, it is not specified in the provided data excerpt and should be confirmed in the latest datasheet.

  • Brand/Manufacturer: Analog Devices
  • Series: ADXL355
  • Type: 3‑axis digital MEMS accelerometer
  • Orientation Axes: X, Y, Z
  • Measurement Range (selectable): ±2.048 g / ±4.096 g / ±8.192 g
  • Output Interface: SPI, I²C
  • Output Type: Digital
  • Supply Voltage (nominal): 3.3 V
  • Package/Case: 14‑pin CLLCC
  • Mounting Type: Surface‑mount
  • Pin Count: 14
  • Category: Sensors > Accelerometers > MEMS
  • Environmental/Operating Temperature: Not specified in provided data (consult datasheet)
  • Noise density / Zero‑g offset / Bandwidth / ODR: Not specified in provided data (consult datasheet)

Package and Mechanical Considerations

  • Package: 14‑pin ceramic leadless chip carrier (CLLCC)
  • Format: Leadless LCC pads support reliable SMT assembly and can offer improved thermal and mechanical performance compared with plastic packages.
  • Orientation: Marking/orientation cues on the package should be referenced during PCB layout to align sensor axes with the intended coordinate frame.
  • Assembly: Use manufacturer‑recommended reflow profiles and handling guidelines for ceramic leadless packages. Mechanical coupling between the PCB and the sensor is critical for vibration applications; maintain board rigidity and minimize parasitic resonances.

Digital Interfaces: SPI and I²C

  • The ADXL355BEZ outputs digital acceleration data via SPI or I²C, enabling straightforward integration with microcontrollers, SoCs, and data acquisition modules.
  • Selection between SPI and I²C is typically a function of bus availability, speed requirements, and system‑level noise immunity considerations.
  • Register configuration, data framing, and bus timing specifics should be taken from the latest ADXL354/ADXL355 datasheet.

Practical guidance:

  • SPI is often preferred for higher throughput and lower susceptibility to bus contention in multi‑sensor designs.
  • I²C reduces pin count and can simplify wiring in compact systems; ensure pull‑ups and bus capacitance are tuned per system constraints.

Range Selection and Use‑Case Alignment

The ADXL355BEZ offers three selectable full‑scale ranges. Choosing the right range helps maximize resolution within your expected acceleration envelope:

  • ±2.048 g: Best for precision tilt and low‑amplitude vibration where finer resolution is advantageous.
  • ±4.096 g: Balanced choice for general industrial sensing and moderate vibration levels.
  • ±8.192 g: Suitable for higher‑amplitude events in machines and structures.

While the ADXL355 series is widely recognized for low noise and low drift, specific performance metrics (e.g., noise density, bias stability) are not listed in the provided data and should be verified in the datasheet for design‑critical decisions.

Applications

The Analog Devices ADXL355BEZ is a solid fit for a wide span of precision motion‑sensing use cases:

  • Condition monitoring and vibration analysis
  • Precision tilt and inclinometers
  • Structural health monitoring
  • Platform stabilization and instrumentation

Example application contexts:

  • Monitoring rotating equipment for early fault detection in predictive maintenance programs
  • Measuring low‑frequency tilt and slowly varying orientation changes in surveying and instrumentation
  • Capturing building or bridge vibrations for structural integrity assessment
  • Stabilizing platforms in laboratory or industrial test setups

Design and Integration Tips

To get the most from the ADXL355BEZ in production designs:

  • Power integrity: Provide a clean, well‑decoupled 3.3 V nominal supply close to the device pins. Use local bypass capacitors per datasheet recommendations.
  • Grounding: Maintain a solid ground reference and minimize loop areas around the sensor and its digital interface lines.
  • Layout: Keep high‑current and high‑speed digital traces away from the sensor area. Consider guard regions or ground fills to reduce coupling.
  • Mechanical isolation: For vibration measurements, ensure consistent and repeatable mechanical coupling. Avoid placing the sensor near board edges or flexible sections that might introduce resonance.
  • Interface robustness: If using I²C, confirm bus pull‑ups and total capacitance meet timing margins. If using SPI, review clock polarity/phase and validate signal integrity with your intended cable/trace lengths.
  • Calibration and compensation: Implement factory or in‑system calibration routines as needed. Temperature effects are a practical consideration; the ADXL355 family is designed for stability over temperature, but application‑specific calibration may still improve accuracy.

Note: Specific bandwidths, output data rates, and register settings are not provided here and should be taken directly from the Analog Devices ADXL354/ADXL355 datasheet.

Sourcing, Part Numbering, and Packaging

  • MPN: ADXL355BEZ (Analog Devices)
  • Package: 14‑pin CLLCC
  • Packaging: Tray
  • Mounting: Surface‑mount
  • Compliance suffix: The Z suffix denotes RoHS compliance per manufacturer notes.

Procurement notes:

  • Verify the full MPN and suffix to match package, compliance, and interface needs.
  • ADXL355BEZ is listed with an active lifecycle status as of the referenced source; confirm current status on the Analog Devices product page during sourcing.
  • For long‑term programs, review product change notifications (PCNs) and lifecycle dashboards provided by the manufacturer.

Lifecycle and Compliance

  • Lifecycle status: Active (per Analog Devices product page)
  • Reported replacements: None specified in the provided data
  • RoHS: RoHS compliant (lead‑free; Z‑suffix denotes RoHS compliance)
  • REACH: REACH compliant (per manufacturer disclosures)

If your application requires additional environmental certifications or detailed substance declarations, consult Analog Devices’ compliance documentation linked from the product page.

Why Choose the Analog Devices ADXL355BEZ?

  • Precision orientation and vibration sensing: The ADXL355 series is known for low noise and low drift, enabling stable readings over time and temperature.
  • Digital convenience: SPI and I²C outputs minimize the need for external ADCs and simplify firmware.
  • Industrial‑grade packaging: The 14‑pin ceramic LCC supports rugged environments and consistent SMT assembly.
  • Vendor confidence: Analog Devices’ MEMS accelerometer portfolio is widely used in industrial, instrumentation, and condition‑monitoring deployments.

Frequently Asked Questions (FAQs)

  • What g‑range options does the ADXL355BEZ support?

  • It provides selectable full‑scale ranges of approximately ±2.048 g, ±4.096 g, and ±8.192 g.

  • What digital interfaces are supported?

  • The device supports both SPI and I²C digital interfaces.

  • What package is the ADXL355BEZ supplied in?

  • A 14‑pin ceramic leadless chip carrier (CLLCC) package; this listing is supplied in Tray packaging.

  • What is the nominal supply voltage?

  • 3.3 V nominal.

  • Is the ADXL355BEZ analog or digital output?

  • Digital output (SPI/I²C).

  • What is the operating temperature range?

  • Not specified in the provided data; refer to the official datasheet for temperature ratings.

  • Is the ADXL355BEZ RoHS and REACH compliant?

  • Yes. It is listed as RoHS compliant (Z‑suffix) and REACH compliant per manufacturer disclosures.

  • Is the ADXL355BEZ still in production?

  • It is listed as Active; verify current status on the Analog Devices product page.

Resources

  • Product page: https://www.analog.com/en/products/adxl355.html
  • Datasheet (ADXL354/ADXL355): https://www.analog.com/media/en/technical-documentation/data-sheets/ADXL354_355.pdf

Conclusion

The Analog Devices ADXL355BEZ brings together low noise, low drift performance and a rugged 14‑pin CLLCC package with flexible digital interfaces, making it a strong choice for vibration analysis, precision tilt, and industrial sensing. With selectable ±2.048 g, ±4.096 g, and ±8.192 g ranges, a nominal 3.3 V supply, and SPI/I²C outputs, it supports clean integration into embedded systems while maintaining measurement stability across environmental conditions. Its active lifecycle status and RoHS/REACH compliance further simplify sourcing for long‑term programs.

If you need a dependable 3‑axis digital accelerometer for condition monitoring, structural health monitoring, instrumentation, or platform stabilization, the ADXL355BEZ is a compelling option to evaluate. For design‑critical parameters—such as bandwidth, output data rate, noise density, and temperature ratings—consult the latest ADXL354/ADXL355 datasheet and the Analog Devices product page to finalize your selection and ensure compliance with your system requirements.

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