ASM330LHHTR

STMicroelectronics ASM330LHHTR Automotive 6‑Axis IMU (Accel + Gyro)

The STMicroelectronics ASM330LHHTR is an automotive‑grade 6‑axis inertial measurement unit (IMU) that combines a 3‑axis accelerometer and a 3‑axis gyroscope in a compact, production‑ready package. Part of the ASM330LHH series, this device targets automotive and industrial motion sensing where reliability, small form factor, and digital interfacing are essential. With support for I2C and SPI, adjustable full‑scale ranges for both accelerometer and gyroscope, and a maximum output data rate up to approximately 6.6 kHz (typical), ASM330LHHTR offers a flexible foundation for systems ranging from vehicle dynamics monitoring to navigation and dead‑reckoning.

Engineers, buyers, and sourcing managers will appreciate that ASM330LHHTR is AEC‑Q100 qualified and RoHS compliant, arrives in tape‑and‑reel for automated assembly, and is housed in a low‑profile 14‑lead LGA (about 2.5 × 3.0 × 0.83 mm). The broad supply range (1.71 V to 3.6 V) eases integration into 1.8 V and 3.3 V digital systems without external regulators in many designs.

Why choose the ASM330LHHTR?

• Automotive pedigree: AEC‑Q100 qualification supports use in safety‑related and rugged automotive environments.
• Design flexibility: I2C or SPI digital interfaces, multiple accelerometer and gyroscope full‑scale settings, and high ODR options.
• Compact footprint: LGA‑14 package with a small 2.5 × 3.0 mm footprint enables tight layouts and multi‑sensor modules.
• Streamlined sourcing: Active lifecycle status from STMicroelectronics with automotive and environmental compliance helps reduce qualification overhead.
• Series continuity: As a member of the ASM330LHH series, it aligns with established hardware and firmware design patterns.

Key specifications

• Brand: STMicroelectronics
• Series: ASM330LHH
• Device type: 6‑axis IMU (3D accelerometer + 3D gyroscope)
• Digital interfaces: I2C, SPI
• Supply voltage (Vdd): 1.71 V to 3.6 V (typical range)
• Accelerometer full‑scale options: ±2 g, ±4 g, ±8 g, ±16 g
• Gyroscope full‑scale options: ±125 dps, ±250 dps, ±500 dps, ±1000 dps, ±2000 dps
• Max ODR (accelerometer/gyroscope): up to approximately 6.6 kHz (typ.)
• Package: LGA‑14, about 2.5 × 3.0 × 0.83 mm
• Mounting type: Surface‑mount
• Pin count: 14
• Qualification: Automotive (AEC‑Q100)
• RoHS status: RoHS compliant

Notes:

• Some parameters such as operating temperature, noise density, bias stability, FIFO depth, and embedded features are not specified here. Consult the official datasheet for complete electrical and mechanical details.
• Dimensions listed are approximate and for guidance; refer to the datasheet and CAD models for exact tolerances.

Applications and use cases

• Automotive motion sensing and stabilization
• Telematics, navigation, and dead‑reckoning support
• Vehicle dynamics monitoring and ADAS support functions
• Industrial vibration and motion sensing

These applications benefit from the ASM330LHHTR’s tunable dynamic ranges and high ODR capability. For example, a dead‑reckoning algorithm can favor higher ODR to improve temporal resolution, while a vibration monitoring node may select specific full‑scale and ODR settings to capture targeted frequency bands.

Architecture overview

ASM330LHHTR integrates a triaxial accelerometer and triaxial gyroscope with digital signal conditioning and I2C/SPI control, delivering calibrated acceleration and angular rate data to the host processor. The dual‑interface option helps match system buses, and the broad supply range is compatible with common embedded platforms. While the complete internal block diagram and embedded feature set are not provided here, the device is designed to support automotive reliability requirements and high‑rate sampling.

Design‑in guidance

Power and decoupling

• Operate the device within the specified supply range of 1.71 V to 3.6 V.
• Place local decoupling capacitors near the Vdd pin(s); use a low‑impedance return path to ground. Specific capacitor values are not specified in the datasheet excerpt here; follow the recommendations in the official datasheet and application notes.
• If interfacing to a 3.3 V host, ensure logic‑level compatibility is maintained per the datasheet’s digital IO specifications.

Interface selection and signal integrity

• Choose I2C when bus sharing and simple wiring are priorities; choose SPI for higher throughput and deterministic timing.
• Keep bus traces short and well‑routed. For SPI, match trace lengths for SCLK and data lines when working at higher speeds.
• Use appropriate pull‑ups for I2C; follow datasheet guidance for value selection and bus capacitance limits.

Mechanical placement

• Position the IMU with its axes aligned to the vehicle or system reference frame to simplify calibration and sensor fusion.
• Mount the LGA package on a rigid portion of the PCB to minimize bending‑induced offsets.
• Avoid placing the sensor near high‑vibration actuators unless those dynamics are the intended signal. Use a mechanically consistent, thermally stable region of the board.

Configuration and performance tuning

• Select full‑scale ranges that fit the expected dynamics. For high‑g events, use ±16 g; for fine resolution in gentle maneuvers, use ±2 g. Similarly, match gyroscope range to expected angular rates.
• Choose ODRs up to approximately 6.6 kHz (typ.) when capturing fast events or when downstream filtering requires oversampling. Lower ODRs reduce data rate and power.
• Implement calibration routines during manufacturing (e.g., offset and scale factor) and consider in‑field self‑calibration if your system supports it.
• Use digital filtering in your host processor or IMU configuration to control bandwidth and noise; consult the datasheet for available filter options.

Packaging, handling, and assembly

• Package: LGA‑14, approximately 2.5 × 3.0 × 0.83 mm; low profile supports tight enclosures and multi‑board stacks.
• Orientation: Follow the package pin‑1 indicator and axis markings in the datasheet to preserve coordinate consistency.
• Packaging for shipment: Tape & Reel (suffix TR) supports automated pick‑and‑place assembly.
• Mounting: Surface‑mount. Reflow profile, moisture sensitivity level, and storage conditions are not specified here; follow ST’s datasheet and product handling guidelines.

Because the package is small and low‑mass, pick‑and‑place nozzle selection and vision alignment settings should be validated on your SMT line. Use a recommended land pattern per ST documentation, and verify solder joint fillets and standoff during process qualification.

Lifecycle, supply chain, and alternatives

• Lifecycle status: Active (per STMicroelectronics)
• Replacements: Not specified in datasheet
• Approved alternates: Not specified in datasheet
• Inventory status: 0 units available in the provided record; check distributors or ST for current availability

From a sourcing perspective, the automotive qualification reduces vendor approval friction, and RoHS compliance simplifies environmental documentation. If your AVL requires second‑source options, consult ST’s portfolio for IMUs within the ASM330LHH family or engage ST for guidance. Since no official replacements or alternates are listed here, be sure to confirm pin‑compatibility and performance equivalence directly from the manufacturer before making substitutions.

Compliance and quality

• AEC‑Q100: Automotive qualified
• RoHS: Lead‑free, ECOPACK compliant
• Additional environmental or reliability data: Not specified in datasheet
• Operating temperature range: Not specified in datasheet

For PPAP, FMEA, and detailed reliability data (e.g., FIT rates), coordinate directly with STMicroelectronics or an authorized distributor. Documentation availability can vary by program and region.

Performance configuration: full‑scale and ODR selection

Optimizing ASM330LHHTR for your application typically starts with selecting full‑scale ranges and the output data rate.

• Accelerometer full‑scale options: ±2 g, ±4 g, ±8 g, ±16 g
• Use ±2 g for high resolution in normal‑dynamics applications (e.g., ride comfort analysis)
• Use ±16 g for high‑impact or aggressive maneuvers
• Gyroscope full‑scale options: ±125 dps, ±250 dps, ±500 dps, ±1000 dps, ±2000 dps
• Use ±125 dps for fine rotational tracking
• Use ±2000 dps for fast motion and harsh dynamics
• ODR: Up to approximately 6.6 kHz (typ.) for both accelerometer and gyroscope
• High ODR improves temporal resolution and supports oversampling strategies
• Lower ODR conserves power and reduces host processing load

When integrating with sensor fusion stacks (e.g., complementary or Kalman filters), match ODR and bandwidth to your estimator’s update rate and noise assumptions. Always verify that anti‑alias filters and host sampling are coordinated to avoid spectral folding.

Practical application scenarios

Automotive motion sensing and stabilization

In chassis control or body motion sensing, ASM330LHHTR can feed real‑time acceleration and angular rate to vehicle controllers. Engineers can start with moderate ODRs (hundreds of Hz), adjust full‑scale ranges based on vehicle dynamics, and iterate using logged data to refine filter settings. Automotive qualification provides confidence in performance under typical vehicular conditions.

Telematics and dead‑reckoning

When GNSS coverage is intermittent, a 6‑axis IMU supports dead‑reckoning between fixes. Select a stable ODR that aligns with your navigation filter, and tune ranges to avoid saturation during acceleration or sharp turns. The digital interfaces simplify connection to microcontrollers or telematics SoCs.

Industrial vibration and motion sensing

For condition monitoring, elevating ODR toward the upper range helps capture higher‑frequency content. Pair the IMU with appropriate enclosures and mounting to ensure the mechanical path faithfully transmits the vibration of interest. Use the wide accelerometer ranges to handle both low‑level vibration and occasional shocks.

Ordering information

• Manufacturer: STMicroelectronics
• MPN: ASM330LHHTR
• Series: ASM330LHH
• Package: LGA‑14 (about 2.5 × 3.0 × 0.83 mm)
• Packaging: Tape & Reel (TR)

The “TR” suffix denotes tape‑and‑reel packaging for automated assembly. If your build requires cut tape or alternate packaging, verify availability with your distributor. Ensure the purchasing description explicitly includes ASM330LHHTR to receive the automotive‑qualified variant in tape‑and‑reel.

Sourcing checklist

• Confirm lifecycle status: Active (check current status prior to production lock)
• Verify compliance needs: AEC‑Q100 and RoHS boxes checked; request any supplementary environmental documents if required by your quality system
• Align electrical: Ensure host logic levels and power rail fall within 1.71–3.6 V
• Lock configuration: Document selected full‑scale ranges, ODR, and interface (I2C vs SPI) in your product’s BOM or configuration database
• Plan for calibration: Define factory and field calibration workflows; capture coefficients in NVM as appropriate

Frequently asked questions (FAQs)

Q: What interfaces does the STMicroelectronics ASM330LHHTR support?
A: Digital I2C and SPI interfaces.

Q: Is the ASM330LHHTR automotive qualified?
A: Yes. It is an automotive‑grade device and is AEC‑Q100 qualified.

Q: What is the package type and pin count?
A: A compact 14‑lead LGA package, approximately 2.5 × 3.0 × 0.83 mm, with 14 pins.

Q: What supply voltage range does ASM330LHHTR require?
A: 1.71 V to 3.6 V (typical operating range).

Q: What are the available full‑scale ranges?
A: Accelerometer: ±2/±4/±8/±16 g. Gyroscope: ±125/±250/±500/±1000/±2000 dps.

Q: What is the maximum output data rate?
A: Up to approximately 6.6 kHz (typical) for accelerometer and gyroscope.

Q: What is the operating temperature range?
A: Not specified in the datasheet excerpt provided here; consult the official datasheet for temperature ratings.

Q: Is the part RoHS compliant?
A: Yes, it is RoHS compliant and ECOPACK lead‑free.

Q: What is the mounting type?
A: Surface‑mount.

Q: Are there designated replacements or alternates?
A: Not specified in the datasheet; consult STMicroelectronics for guidance on pin‑compatible or performance‑equivalent options.

Resources

• Product page: https://www.st.com/en/mems-and-sensors/asm330lhh.html
• Datasheet: https://www.st.com/resource/en/datasheet/asm330lhh.pdf

Disclaimer: Only key parameters are summarized here. For complete, authoritative specifications, operational limits, timing, mechanical drawings, and application recommendations, always refer to the official STMicroelectronics datasheet and product documentation for ASM330LHHTR.