DP83867CRRGZT

Texas Instruments DP83867CRRGZT Gigabit Ethernet PHY — 48‑VQFN (RGZ), Commercial 0°C to 70°C

The Texas Instruments DP83867CRRGZT is a single‑port 10/100/1000BASE‑T Ethernet PHY transceiver built for robust, low‑power copper networking in space‑constrained designs. Packaged in a 48‑pin VQFN (RGZ) and qualified for the commercial 0°C to 70°C range, this device brings IEEE 802.3 standards compliance and flexible MAC connectivity (RGMII, GMII, MII) to embedded products, gateways, IoT edge systems, and industrial controls.

Quick summary

• MPN: DP83867CRRGZT (Texas Instruments DP83867 series)
• Function: Single‑port 10/100/1000BASE‑T Ethernet PHY transceiver
• Package: 48‑VQFN (RGZ), Tape & Reel (TR)
• MAC interfaces: RGMII, GMII, MII
• Temperature: 0°C to 70°C (Commercial)
• Compliance: IEEE 802.3; RoHS

Why choose the DP83867CRRGZT for your next design?

Engineers selecting a Gigabit Ethernet PHY typically weigh standards compliance, interface flexibility, package size, thermals, and lifecycle stability. The Texas Instruments DP83867CRRGZT delivers on these essentials:

• Standards‑based Gigabit link: IEEE 802.3 compliance across 10BASE‑T, 100BASE‑TX, and 1000BASE‑T simplifies interoperability and certification planning.
• Flexible MAC connectivity: RGMII, GMII, and MII interfaces allow straightforward connection to a broad range of SoCs, FPGAs, and microprocessors.
• Compact footprint: The 48‑VQFN (RGZ) package helps meet tight PCB area budgets common in gateways, compact SBC add‑on modules, and dense industrial designs.
• Commercial‑grade operation: 0°C to 70°C coverage aligns with the needs of consumer, enterprise, and many controlled‑environment industrial applications.
• Active lifecycle: Current TI lifecycle status is Active, supporting long‑term product planning and minimizing redesign risk.

If you’re architecting a low‑power, single‑port copper Ethernet interface, the DP83867CRRGZT provides a clean, standards‑compliant PHY path while keeping BOM and layout practical.

Key features and benefits

• 10/100/1000 Mb/s operation for versatile link speeds
• IEEE 802.3 standards compliance for copper Ethernet
• RGMII/GMII/MII MAC interface options to match your host device
• 48‑pin VQFN (RGZ) for compact, surface‑mount assembly
• RoHS compliant; lead‑free for global environmental compliance

Note: Some electrical parameters (for example, supply rails and current draw) are not specified here. Always consult the TI datasheet for full electrical characteristics and configuration details.

Detailed specifications

• Manufacturer/Brand: Texas Instruments
• Series: DP83867
• Category: Ethernet PHY Transceiver
• MPN: DP83867CRRGZT
• Ethernet Standards: 10BASE‑T / 100BASE‑TX / 1000BASE‑T (IEEE 802.3)
• MAC Interface: RGMII, GMII, MII
• Data Rates (nominal link speeds): 10/100/1000 Mb/s
• Package: 48‑VQFN (RGZ)
• Packaging: Tape & Reel (TR)
• Pin Count: 48
• Mounting: Surface Mount
• Operating Temperature: 0°C to 70°C (Commercial)
• Lifecycle Status: Active (per TI product page)
• RoHS Status: RoHS Compliant; lead‑free

Not specified in datasheet (here): supply voltages, current consumption, clocking options, strap configuration, and integrated features beyond the interfaces and standards listed. Refer to the TI DP83867CR datasheet for authoritative values and feature lists.

Where the DP83867CRRGZT fits

• Embedded and consumer Ethernet networking
• Gateways and routers
• Industrial controls and automation equipment
• IoT edge devices and SBC/network add‑on cards

These target applications benefit from the PHY’s compact package, flexible MAC interface options, and standards‑compliant copper link. Whether your host is an applications processor with RGMII, a soft MAC in an FPGA over GMII, or a microcontroller using MII at 10/100 Mb/s, the Texas Instruments DP83867CRRGZT provides a straightforward PHY attachment.

Interfaces and integration considerations

• MAC connectivity

• RGMII: Ideal for gigabit links with reduced pin count. Ensure timing closure with the chosen MAC; consult the TI datasheet for required delays and timing constraints.

• GMII: Full‑width gigabit interface. Useful where timing margin is needed and pin budget allows.

• MII: For 10/100 Mb/s designs or fallback modes.

• Magnetics and RJ‑45

• Use magnetics and connectors rated for 10/100/1000BASE‑T. Follow TI’s layout and EMI guidance in the datasheet and application notes for the DP83867 family.

• Clocks and resets

• Clock source, reset requirements, and strap or register configuration details are not specified here. Refer to the datasheet for supported clocking schemes and reset timing.

• Power and decoupling

• Power rails and consumption are not specified in this summary. Apply decoupling per TI’s recommended BOM and placement guidelines.

• Layout and EMI

• Keep the MDI pairs length‑matched and impedance‑controlled to 100 Ω differential. Isolate PHY analog sections from noisy digital domains. Follow ground return and stitching guidance provided in TI documentation.

Packaging, handling, and assembly

• Package: 48‑VQFN (RGZ) with exposed thermal pad
• Mounting: Surface mount, reflow solder compatible
• Delivery: Tape & Reel (TR)

Assembly notes:

• Verify the land pattern from the TI package drawing for RGZ.
• Ensure full solder coverage of the exposed pad per TI guidelines for thermal and electrical performance.
• Reflow profile and MSL information should be taken from the TI datasheet and product packaging.

Compliance and standards

• IEEE 802.3: Compliant with 10BASE‑T, 100BASE‑TX, and 1000BASE‑T
• RoHS: RoHS compliant; lead‑free

This combination aligns the DP83867CRRGZT with mainstream Ethernet requirements while supporting worldwide environmental regulations.

Lifecycle, availability, and sourcing guidance

• Lifecycle: Active (per Texas Instruments product page)
• Availability: Check TI and authorized distributors for current lead time and stock
• Inventory note: If a specific channel shows zero on‑hand, review alternate distributors or plan for factory lead times.

Sourcing checklist:

• Confirm operating temperature (0°C to 70°C) meets your environment. For wider temperature needs, assess other DP83867 family options and verify pin and register compatibility with TI.
• Align the MAC interface (RGMII/GMII/MII) with your host device I/O capabilities.
• Validate compliance needs (IEEE 802.3, RoHS) for your target regions and certifications.
• Lock the package (48‑VQFN RGZ) early to ensure PCB footprint and assembly process readiness.

Approved alternates policy (guidance): Prefer same‑family, pin‑compatible variants when wider temperature or differing feature sets are required. Verify electrical and software compatibility. No specific alternates are listed in the provided data.

Practical design tips

While specific electrical values must come from the TI datasheet, the following best practices can accelerate first‑pass success:

• Define your MAC‑PHY interface early. RGMII saves pins but requires meticulous timing; GMII offers comfortable timing at the cost of more pins.
• Budget for magnetics and RJ‑45 placement to keep MDI traces short and direct. Avoid stubs and layer transitions on the differential pairs.
• Plan a robust power‑up/reset sequence. Review reset timing and configuration requirements in the DP83867CR documentation.
• Provide test access. Include link/activity LEDs (if supported in your design), PHY management access (e.g., MDIO/MDC via your MAC), and convenient probe points for bring‑up.
• EMC from the start. Use common‑mode chokes if recommended in the reference design, adhere to chassis/earth grounding practices at the connector, and isolate PHY grounds appropriately as per TI guidance.

Specifications at a glance

• Device type: Gigabit Ethernet PHY transceiver
• Copper link: 10/100/1000BASE‑T
• MAC interfaces: RGMII, GMII, MII
• Package: 48‑VQFN (RGZ), Tape & Reel
• Operating temperature: 0°C to 70°C (Commercial)
• RoHS: Compliant
• Lifecycle: Active

Values not listed above (for example, supply rails, power consumption, skew/latency, and boot configuration) are not specified in datasheet here; consult the official TI datasheet for details.

Applications

• Embedded and consumer Ethernet networking
• Gateways and routers
• Industrial controls and automation equipment
• IoT edge devices and SBC/network add‑on cards

These use cases often demand a balance of cost, size, and standards compliance. The Texas Instruments DP83867CRRGZT meets those needs with a compact package and flexible host interfaces without locking the design into a specific processor ecosystem.

Frequently asked questions (FAQs)

Q: What Ethernet standards does the Texas Instruments DP83867CRRGZT support?
A: It complies with IEEE 802.3 10BASE‑T, 100BASE‑TX, and 1000BASE‑T copper Ethernet.

Q: Which MAC interfaces are available?
A: RGMII, GMII, and MII are supported, allowing connection to a wide range of SoCs, FPGAs, and microcontrollers with Ethernet MACs.

Q: What is the package and pin count for DP83867CRRGZT?
A: It is offered in a 48‑pin VQFN (RGZ) package for surface‑mount assembly.

Q: What is the operating temperature range?
A: 0°C to 70°C (Commercial grade).

Q: Is the DP83867CRRGZT RoHS compliant?
A: Yes, it is RoHS compliant and lead‑free.

Q: Does this device include a MAC, or is it only a PHY?
A: It is a physical layer (PHY) transceiver. You will connect it to an external MAC contained in your processor, FPGA, or controller via RGMII/GMII/MII.

Q: Are there pin‑compatible variants for wider temperature ranges?
A: The provided data does not list specific replacements. TI’s DP83867 family includes multiple options; review the TI product table and verify pin/register compatibility before substitution.

Q: What are the power supply rails and typical power consumption?
A: Not specified in datasheet here. Refer to the TI DP83867CR datasheet for power rails, decoupling, and consumption figures under various link conditions.

Q: How should I select magnetics for 10/100/1000BASE‑T with this PHY?
A: Choose magnetics rated for 10/100/1000BASE‑T. Follow the TI reference design bill of materials and layout guidance for best performance and EMI behavior.

Resources

• TI product page: https://www.ti.com/product/DP83867CR
• TI datasheet (DP83867CR): https://www.ti.com/lit/ds/symlink/dp83867cr.pdf

Note: Some characteristics may vary by device option. Always consult the latest Texas Instruments datasheet and product page for definitive specifications and availability. For sourcing and lead‑time updates, check authorized TI distributors.