KP13C-6S-SF(800)

Hirose KP13C-6S-SF(800) Nano SIM (4FF) Connector – 6-Position SMT Right-Angle, Gold Contacts

Quick summary

The Hirose KP13C-6S-SF(800) is a compact, board-mount Nano SIM (4FF) connector from Hirose Electric Co., Ltd. Designed for space-constrained mobile and IoT designs, it provides six gold-plated contacts in a right-angle, surface-mount configuration for efficient PCB edge routing and low-profile integration.

• Brand/Manufacturer: Hirose Electric Co., Ltd. (Hirose)
• Series: KP13
• MPN: KP13C-6S-SF(800)
• Category: Connectors > Card & SIM Connectors > Nano SIM (4FF)
• Key attributes: 6 positions, Nano SIM (4FF), gold contacts, right-angle, surface-mount

Overview

The Hirose KP13C-6S-SF(800) is part of the KP13 series, a family focused on reliable mechanical and electrical interfacing for Nano SIM (4FF) cards. By combining a low-profile, right-angle housing with surface-mount pads, this connector fits modern handhelds and networked edge devices where PCB real estate and height are at a premium. Gold-plated contacts support consistent contact resistance over time and help resist corrosion in challenging use environments.

Because it implements the Nano SIM (4FF) mechanical interface with six positions, the connector targets designs such as cellular-enabled IoT nodes, M2M terminals, gateways, and compact handhelds. The right-angle orientation simplifies traces to baseband/SIM interfaces on multilayer boards and can ease mechanical integration at the board edge or beneath shielding cans.

Key features and benefits

• Nano SIM (4FF) form factor: Ensures compatibility with the most compact removable SIM card standard.
• 6-position contact array: Matches popular SIM interface implementations that do not require additional pads beyond the core six.
• Right-angle orientation: Facilitates edge-mounted layouts and efficient routing on dense PCBs.
• Surface-mount termination: Streamlines automated assembly using standard reflow processes; no through-hole operations required.
• Gold-plated contacts: Provides robust contact performance and corrosion resistance for long-term reliability.
• Compact footprint: Well-suited to mobile devices and space-constrained IoT designs.

Specifications

The following specifications are provided from the structured data and should be verified against the latest Hirose KP13 series documentation for the KP13C-6S-SF(800) variant.

• Card type: Nano SIM (4FF)
• Number of positions: 6
• Contact plating: Gold
• Orientation: Right angle
• Termination: Surface mount (SMT)
• Mounting type: Surface Mount, Right Angle
• Pin count: 6
• Operating temperature: Not specified in provided data (refer to datasheet)
• Packaging/Carrier: Not specified in provided data (refer to datasheet)
• Environmental/Compliance: Not specified in provided data (refer to datasheet)

Note: The exact meaning of the suffix “(800)” and any packaging or tape-and-reel/tray options should be confirmed in the Hirose KP13 series datasheet for this specific ordering code.

Mechanical and layout considerations

• Board edge placement: The right-angle style is commonly leveraged at the PCB edge to simplify card insertion paths and maintain enclosure clearances. Plan for adequate keep-outs so the card can be inserted and removed without interference.
• PCB land pattern: Follow the recommended footprint from the Hirose KP13 series datasheet to ensure proper solder fillets and coplanarity. Avoid altering pad dimensions without signal integrity and manufacturability validation.
• Shielding and EMI: SIM clock and I/O lines can be sensitive to noise. Keep traces short, use ground reference where possible, and consider placement under or near RF shields depending on the system layout.
• Insertion access: Ensure the enclosure design provides user access for card insertion/removal if the SIM is field-serviceable. For sealed devices, consider whether the SIM will be installed during manufacturing.
• Stiffness and retention: Mechanical reinforcement features, if present in the specific KP13 variant, should be reflected in the PCB design. If no additional anchors are used, confirm that enclosure elements (bosses, ribs) help protect the connector against point loads.

Electrical interface best practices

While detailed electrical characteristics for this specific part are not provided here, consider the following general practices for SIM interfaces:

• Trace impedance and routing: Keep SIMCLK and SIMIO short and away from strong aggressors. Series resistors and ESD protection devices should be located close to the connector or the baseband IC as recommended by the chipset vendor.
• ESD protection: Place dedicated ESD diodes on exposed lines per your system’s ESD strategy. Select devices with appropriate capacitance to avoid degrading signal integrity.
• Power rails: Verify voltage domains (typically 1.8 V or 3.0 V for SIM) at the baseband and confirm that level shifting—if required—is implemented as per the chipset guidance.

Applications

The Hirose KP13C-6S-SF(800) is a strong fit for designs that require removable carrier authentication via a Nano SIM card:

• Mobile devices
• IoT modules and gateways
• M2M communication devices
• Embedded systems requiring Nano SIM

These use cases benefit from the compact Nano SIM format, right-angle insertion geometry, and SMT assembly flow.

Design-in tips

• Check pinout alignment: Ensure the 6-position mapping aligns with your baseband/UICC interface. If the application requires additional pads beyond six, consider an alternate variant with more positions.
• Verify card handling features: Features such as push-push, friction-lock, or card-detect switches can vary by connector variant. The provided data does not specify these; consult the KP13 series datasheet for the KP13C-6S-SF(800) feature set.
• Reflow profile: Use the reflow profile specified by Hirose for KP13 series connectors. Avoid manual touch-up that can stress the housing.
• Durability testing: Validate insertion/extraction cycles during DV/PV testing with production-intent cards and enclosures to ensure appropriate fit and feel over life.

Sourcing and supply chain considerations

• Availability: Inventory quantity in the provided data is 0 at the time of capture. Check authorized distributors and the Hirose channel for current stock status and lead times.
• Approved alternates: None are listed in the provided data. If schedule risk exists, evaluate compatible KP13 series variants (and confirm footprint/height and mechanical features before substitution).
• Packaging: Specific packaging details (e.g., tape-and-reel vs. tray) were not provided. Confirm packaging and MOQ to align with your assembly line setup.
• Part marking and traceability: Ensure your AVL and internal PNs capture the full ordering code (including suffixes like “(800)”) to avoid mis-picks between similar KP13 variants.

Lifecycle and replacements

• Lifecycle status: Not specified in the provided data. Consult Hirose’s product page or distribution partners for current lifecycle stage (Active, NRND, EOL).
• Replacements/second sources: None listed in the provided data. Evaluate within the Hirose KP13 family for drop-in or near drop-in options. Always cross-check pad layouts, keep-outs, and insertion mechanics before approving alternates.

Compliance and environmental

• RoHS/REACH: Not specified in the provided data. Request up-to-date material declarations or compliance certificates from Hirose or authorized distributors.
• Halogen-free and other environmental claims: Not specified in the provided data.
• Operating temperature range: Not specified in the provided data. Verify environmental rating against your product’s target markets and compliance regimes.

If your end product targets markets with stringent environmental requirements, retain the latest compliance documentation in your PPAP or technical construction file.

Why choose the Hirose KP13C-6S-SF(800)?

• Space efficiency: Nano SIM (4FF) geometry and right-angle orientation minimize Z-height and support compact enclosures.
• Assembly-friendly: SMT termination supports high-throughput automated assembly.
• Contact reliability: Gold-plated contacts are an industry-standard approach for robust signal connectivity in low-current card interfaces.
• Reputable brand: Hirose is a well-established interconnect supplier with a broad ecosystem of card connectors and global distribution.

Validation checklist for engineers and buyers

• Confirm card standard: Nano SIM (4FF) is correct for your product plan.
• Verify position count: 6 contacts meet your SIM pad requirements.
• Check mechanical features: Insertion method, card-detect (if required), and any retention features for this specific variant.
• Review footprint: Match the exact KP13C-6S-SF(800) recommended land pattern and any keep-outs.
• Confirm compliance: Obtain current RoHS/REACH and material declarations.
• Align packaging: Ensure tape-and-reel or tray format fits your SMT process.
• Validate lifecycle and lead time: Confirm part status and supply plan before committing to production.

Frequently asked questions (FAQs)

Q: What card type does the Hirose KP13C-6S-SF(800) support?
A: It is designed for Nano SIM (4FF) cards.

Q: How many contacts are provided?
A: Six positions (6 contacts).

Q: What is the connector orientation and mounting style?
A: Right-angle, surface-mount (SMT).

Q: Are the contacts gold-plated?
A: Yes, the contacts are gold-plated.

Q: Does this connector include a card-detect switch or a specific ejection mechanism?
A: Not specified in the provided data. Review the KP13 series datasheet for the KP13C-6S-SF(800) to determine mechanical features like card-detect or push-push mechanisms.

Q: Is there a specified operating temperature range?
A: Not specified in the provided data. Refer to the latest Hirose documentation.

Q: Is the part RoHS compliant?
A: Not specified in the provided data. Obtain the latest compliance statements from Hirose or authorized distributors.

Q: What if my application requires more than six SIM contacts?
A: Choose a connector variant with additional positions and confirm compatibility with your baseband’s UICC interface.

Q: Can this be used for eSIM?
A: eSIM (embedded SIM) is implemented as a soldered IC and does not use a removable SIM connector. The KP13C-6S-SF(800) is for removable Nano SIM cards.

Resources

• Datasheet (KP13 series): https://media.digikey.com/pdf/Data%20Sheets/Hirose%20PDFs/KP13_Series.pdf

Note: Details such as exact packaging code and operating temperature should be confirmed from the latest Hirose datasheet for the specific KP13C-6S-SF(800) variant.