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MT25QL01GBBB8ESF-0AAT

SPIFLASHNORSLC256MX4SOICDDP, Tray, Flash; SPIFLASHNORSLC256MX4SOICDDP, Tray, Flash IC

Manufacturer

Micron

Mrf. Part #

MT25QL01GBBB8ESF-0AAT

Package

Key Attributes

Datasheet

Products Specifications

Micron MT25QL01GBBB8ESF-0AAT Serial NOR Flash (1 Gb, SPI/Quad SPI, 3V)

The Micron MT25QL01GBBB8ESF-0AAT is a 1 Gb (128 MB) Serial NOR Flash device from the proven MT25Q family. Targeted at reliable code storage and boot applications, this SLC Serial NOR integrates SPI, Dual SPI, and Quad SPI (QPI) interfaces and operates from a 2.7 V to 3.6 V supply. Housed in a space-efficient SOIC-16W (300 mil) dual‑die package (DDP) for surface mounting, it offers flexible erase sizes (4 KB/32 KB/64 KB) and 256‑byte page programming to streamline firmware management in embedded, industrial, networking, and consumer designs.

  • Brand / Manufacturer: Micron Technology, Inc.
  • Series: MT25Q
  • MPN: MT25QL01GBBB8ESF-0AAT
  • Category: Memory > Flash > Serial NOR (SPI/QSPI)

At a Glance: Why Choose the MT25QL01GBBB8ESF-0AAT?

  • Density: 1 Gb (128 MB) SLC Serial NOR
  • Interface: SPI / Dual SPI / Quad SPI (QPI)
  • I/O Width: x1 / x2 / x4
  • Supply Voltage (Vcc): 2.7 V to 3.6 V
  • Page Size: 256 bytes
  • Sector Erase Sizes: 4 KB, 32 KB, 64 KB
  • Operating Temperature: -40°C to +85°C
  • Package: SOIC-16W (300 mil), DDP; Pin Count: 16; Mounting: Surface Mount
  • Packaging: Tray
  • RoHS Status: RoHS Compliant

These attributes make the Micron MT25QL01GBBB8ESF-0AAT a dependable choice for boot memory and code storage, where predictable erase/program behavior and multi‑I/O flexibility are critical.

Where the MT25QL01GBBB8ESF-0AAT Fits

Micron’s MT25Q family is designed to meet the needs of systems that require reliable, reprogrammable nonvolatile memory for firmware, bootloaders, configuration data, and logs. The MT25QL01GBBB8ESF-0AAT aligns well with:

  • Code storage and boot memory for microcontrollers and application processors
  • Embedded systems that benefit from x1/x2/x4 data throughput options
  • Industrial control and automation equipment operating across -40°C to +85°C
  • Networking and communications platforms with frequent firmware updates
  • Consumer electronics that require robust, long-lived code storage

The combination of 256‑byte page programming and multiple sector sizes allows developers to tune update routines for speed, endurance strategy, and minimal downtime.

Detailed Specifications

Memory Organization and Erase/Program

  • Memory Type: Serial NOR (SLC)
  • Density: 1 Gb (128 MB)
  • Page Size: 256 bytes
  • Sector Erase Sizes: 4 KB, 32 KB, and 64 KB
  • Notes: The mix of fine-grained (4 KB) and larger (32 KB/64 KB) erase options enables efficient update strategies—use small sectors for configuration patches and larger sectors for bulk firmware refreshes.

Interface and I/O Modes

  • Supported Interfaces: SPI, Dual SPI, Quad SPI (QPI)
  • I/O Width: x1 / x2 / x4
  • Supply Voltage: 2.7 V to 3.6 V (3 V class)
  • Not specified in datasheet: Maximum clock frequency, timing parameters, and detailed command timings for this exact ordering code. Consult the Micron MT25Q datasheet for definitive speed and timing limits.

Quad I/O capability (x4) helps reduce firmware load times by increasing data throughput compared to standard SPI. Dual SPI (x2) offers a middle ground for designs that want speed improvements with fewer I/O signals than Quad SPI.

Power, Thermal, and Environmental

  • Operating Temperature: -40°C to +85°C
  • Supply Voltage (Vcc): 2.7 V to 3.6 V
  • Not specified in datasheet: Typical/maximum active current, standby current, deep‑power‑down currents, data retention, and program/erase endurance for this ordering code in the provided data. Refer to the MT25Q datasheet for power and endurance planning.

Package and Mounting

  • Package: SOIC-16W (300 mil), Dual‑Die Package (DDP)
  • Pin Count: 16
  • Mounting Type: Surface Mount (SMT)
  • Packaging: Tray
  • Not specified in datasheet: Package dimensions, land pattern recommendations, and MSL level in the provided data. Check the Micron datasheet and package drawings for layout and assembly details.

How the MT25QL01GBBB8ESF-0AAT Simplifies Firmware Design

  • Flexible updates: The 4 KB sector erase option enables precise patching of small regions without disturbing adjacent code, while 32 KB and 64 KB sectors accelerate full‑image refreshes.
  • Scalable throughput: Start with single‑bit SPI during bring‑up and scale to Dual or Quad I/O for production images and over‑the‑air updates, subject to datasheet‑verified timing limits.
  • Streamlined boot memory: SLC Serial NOR is a common, well‑understood boot medium for MCUs/MPUs, reducing integration risk and shortening time-to-market.

Design and Integration Notes

  • Sector strategy: Organize your firmware image around 4 KB boundaries to enable surgical updates of configuration and bootloader sections. Use larger 32 KB/64 KB sectors for bulk program regions to minimize erase cycles and update time.
  • Page programming: With 256‑byte pages, align write buffers to page boundaries and coalesce writes where possible. This avoids partial‑page penalties and simplifies wear distribution.
  • Status and protection: Many Serial NOR devices provide status/configuration registers for write protection and mode control. Specific register maps and protection schemes for the MT25QL01GBBB8ESF-0AAT are not specified in the provided data—consult the Micron MT25Q datasheet to configure block protection, quad‑enable, and any reset options correctly.
  • I/O mode bring‑up: Systems typically initialize in standard SPI and then enable Dual/Quad modes after verifying device identity. The exact command sequence and dummy cycle requirements are not specified in the provided data; follow the Micron documentation for the MT25Q series.
  • Power integrity: Place adequate high‑frequency decoupling near the Vcc pin(s) and maintain low‑impedance returns to stabilize supply rails during page program or erase operations.
  • Boot robustness: For field‑upgradable systems, consider A/B image layouts and fail‑safe boot logic so that incomplete updates can be recovered without bricking the device.
  • Thermal considerations: Operate the MT25QL01GBBB8ESF-0AAT within -40°C to +85°C and verify erase/program timing across the full range per the datasheet.

Lifecycle, Compliance, and Availability

  • Lifecycle Status: Not specified (check the Micron product page for current status).
  • RoHS / Environmental Compliance: RoHS Compliant.
  • Inventory: Current local inventory is 0 units. For lead times and stocking options, consult authorized distributors or Micron partners.
  • Packaging and Handling: Shipped in trays. Moisture sensitivity level (MSL) and baking requirements are not specified in the provided data—verify in Micron’s packaging documentation.

Proactive sourcing tip: If the MT25QL01GBBB8ESF-0AAT is a design-in target, confirm lifecycle status early and assess multi‑source risk. Serial NOR is widely available, but pinouts, command sets, and QPI details vary by vendor. Lock in procurement plans based on the exact ordering code.

Applications and Use Cases

  • Embedded systems and MCU/MPU boot memory: Reliable, nonvolatile code storage with multi‑I/O options for faster boot sequences.
  • Industrial control and automation: Operates across an industrial temperature range and supports granular updates via 4 KB sectors.
  • Networking and communications: Suitable for firmware and configuration storage where frequent updates benefit from page‑based programming and Quad I/O read throughput.
  • Consumer electronics: Provides robust storage for system firmware, user settings, and fail‑safe bootloaders.

Alternatives and Migration Paths

  • Within the Micron MT25Q family, other densities and package variants may be available. If your design needs more or less capacity, consult Micron’s MT25Q product selector to maintain software and board‑level commonality where possible.
  • If migrating from single‑bit SPI designs, the MT25QL01GBBB8ESF-0AAT enables Dual/Quad I/O paths for higher throughput without a large interface overhaul. Confirm the enable sequences, timing, and electrical limits in the datasheet.

Note: Specific alternative part numbers, speed grades, endurance, and retention figures are not specified in the provided data. Always validate compatibility against Micron’s official documentation.

Sourcing Checklist for Engineers and Buyers

  • Part and brand: Micron MT25QL01GBBB8ESF-0AAT (MT25Q series)
  • Density and type: 1 Gb (128 MB) SLC Serial NOR
  • Interface: SPI / Dual SPI / Quad SPI (QPI), I/O x1/x2/x4
  • Voltage: 2.7 V to 3.6 V
  • Page and erase: 256‑byte page programming; 4 KB / 32 KB / 64 KB erase
  • Environment: -40°C to +85°C
  • Package and mounting: SOIC‑16W (300 mil), DDP; Surface Mount; Tray
  • Compliance: RoHS Compliant
  • Lifecycle: Not specified (verify on Micron product page)
  • Performance: Maximum clock frequency and detailed timing—Not specified in datasheet within the provided data; confirm in Micron’s MT25Q datasheet

This list captures the core criteria to speed up purchasing decisions and technical approvals.

Frequently Asked Questions (FAQs)

  • What is the density of the Micron MT25QL01GBBB8ESF-0AAT?

  • It is a 1 Gb (128 MB) Serial NOR Flash memory device.

  • What interface modes are supported?

  • It supports standard SPI, Dual SPI, and Quad SPI (QPI) modes with I/O widths of x1/x2/x4.

  • What is the operating voltage range?

  • 2.7 V to 3.6 V (3 V class).

  • What erase sizes are supported?

  • Common erase sizes include 4 KB, 32 KB, and 64 KB sectors.

  • What is the operating temperature range?

  • -40°C to +85°C.

  • What is the package for the MT25QL01GBBB8ESF-0AAT?

  • SOIC‑16W (300 mil) Dual‑Die Package (DDP), 16 pins, surface mount; shipped in trays.

  • Is the MT25QL01GBBB8ESF-0AAT RoHS compliant?

  • Yes, it is listed as RoHS Compliant.

  • What is the maximum clock frequency?

  • Not specified in the provided data. Refer to the Micron MT25Q datasheet for the speed grade and timing parameters associated with this ordering code.

  • Does this device support execute‑in‑place (XIP)?

  • Not specified in the provided data. Consult the datasheet for XIP and memory‑mapped read capabilities.

  • What is the lifecycle status of this part?

  • Not specified. Check the Micron product page for current lifecycle information.

Resources

  • Datasheet: https://www.micron.com/-/media/client/global/documents/products/data-sheet/nor-flash/serial-nor/mt25q.pdf
  • Product Page: https://www.micron.com/products/nor-flash/serial-nor-flash/mt25q

If your design requires the specific behavior or timing of the Micron MT25QL01GBBB8ESF-0AAT, always validate against the latest official datasheet and product page before finalizing hardware and firmware. This ensures your system meets performance, reliability, and compliance targets without last‑minute surprises.

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