MT41K256M16TW-107 IT:P

Micron MT41K256M16TW-107 IT:P DDR3L SDRAM — 4Gb, x16, 96-ball FBGA, Industrial Temperature

Engineers building robust embedded platforms often need a stable, well-documented DDR3L memory with proven interoperability and industrial temperature support. Micron’s MT41K256M16TW-107 IT:P delivers that combination: a 4Gb DDR3L SDRAM organized as 256M x16 that operates at 1.35V with backward compatibility to 1.5V DDR3, offered in a compact 96-ball FBGA package tailored for high-density surface-mount designs.

This device belongs to Micron’s MT41K DDR3/DDR3L family and is speed-binned at -107, supporting data rates up to DDR3-1866 per the datasheet’s timing limits. With built-in low-power modes such as Auto Self Refresh (ASR), Temperature-Compensated Self Refresh (TCSR), and Partial Array Self Refresh (PASR), it fits space- and power-constrained systems across industrial and communications markets.

Key highlights

• Manufacturer/Brand: Micron Technology, Inc.
• MPN: MT41K256M16TW-107 IT:P (MT41K series)
• Density and organization: 4Gb total, 256M x16
• Voltage: 1.35V operation (DDR3L) with backward compatibility to 1.5V (DDR3)
• Speed grade: -107, up to DDR3-1866 data rate (see datasheet timing)
• Package: 96-ball FBGA (x16), package code “TW”; surface mount
• Temperature: Industrial grade (IT), -40°C to +85°C ambient
• Burst length options: 4, 8
• On-die termination (ODT): Supported
• Standards: Compliant with JEDEC JESD79-3 (DDR3/DDR3L)
• Environmental: RoHS Compliant (Pb-free)

Overview of the Micron MT41K256M16TW-107 IT:P

Micron’s MT41K256M16TW-107 IT:P is a workhorse DDR3L SDRAM that balances capacity, bandwidth, and low power for embedded systems. The x16 bus width simplifies routing for controllers that support 16-bit interfaces, and the industrial temperature rating ensures reliability from -40°C to +85°C ambient. The 96-ball FBGA footprint supports automated assembly and fits well on compact boards where PCB real estate is at a premium.

The device’s DDR3L 1.35V core operation helps reduce power and heat relative to legacy 1.5V DDR3 operation, while retaining backward compatibility for platforms that still operate at 1.5V within datasheet-defined limits. At the -107 speed grade, the part scales up to DDR3-1866 data rates when used within the specified timing parameters.

Detailed specifications

Because memory timing is application-specific, designers should always consult the official Micron datasheet for AC and DC characteristics. The following summarizes the key device-level attributes available for the Micron MT41K256M16TW-107 IT:P:

Memory organization and density

• Density: 4Gb (4 gigabits)
• Organization: 256M x16
• I/O width: x16
• Burst lengths: 4, 8

Electrical characteristics

• Nominal operating voltage: 1.35V (DDR3L)
• Backward compatibility: Operates at 1.5V for DDR3 systems within datasheet limits
• On-die termination (ODT): Supported

Speed grade and data rate

• Speed bin: -107
• Data rate: Up to DDR3-1866, subject to timing parameters in the datasheet

Package and mounting

• Package: 96-ball FBGA (x16)
• Package code: TW
• Revision: P
• Mounting: Surface mount
• Pin count: 96

Temperature and environment

• Operating temperature (Industrial/IT): -40°C to +85°C ambient
• RoHS status: RoHS Compliant (Pb-free)
• JEDEC standard: JESD79-3 (DDR3/DDR3L)

Low-power feature set

• Auto Self Refresh (ASR)
• Temperature-Compensated Self Refresh (TCSR)
• Partial Array Self Refresh (PASR)

Note: Some electrical and timing parameters vary by speed bin and revision. Refer to the Micron datasheet for complete AC/DC characteristics.

Applications and design fit

The Micron MT41K256M16TW-107 IT:P targets designs that need a dependable DDR3L memory at industrial temperatures:

• Industrial embedded systems: Controllers, HMIs, programmable logic devices, and ruggedized gateways benefit from the -40°C to +85°C ambient rating and DDR3L power savings.
• Networking and telecommunications equipment: Routers, access points, baseband cards, and line cards use DDR3/DDR3L SDRAM for packet buffers, tables, and queues where bandwidth and low-latency operation are essential.
• Consumer electronics: Set-top boxes, media players, and displays that support DDR3/DDR3L interfaces can leverage the x16 configuration to balance bandwidth and layout complexity.
• Data communications and general computing: Industrial PCs, single-board computers, and communication modules utilize 4Gb DDR3L for OS, buffers, and application working sets.

Why it fits well

• x16 organization keeps routing and controller configuration straightforward where a 16-bit interface is preferred or required.
• 1.35V DDR3L operation cuts active and standby power compared with 1.5V-only devices, with the flexibility to interoperate at 1.5V when needed.
• Industrial temperature rating enhances reliability for field deployments in harsh or uncontrolled environments.
• Support for PASR, ASR, and TCSR helps reduce standby power, which is valuable for always-on and thermally constrained systems.

Integration and design-in guidance

Every memory controller and PCB layout is unique, but the following considerations help streamline integration of the Micron MT41K256M16TW-107 IT:P into your design. Always cross-check against the Micron datasheet and your controller vendor’s DDR3/DDR3L guidelines.

• Voltage planning: If your platform supports DDR3L, run at 1.35V for better power efficiency. If you must interoperate at 1.5V, confirm controller compatibility and adhere to the datasheet’s limits.
• Controller configuration: Select the appropriate burst length (BL4 or BL8) based on your controller’s supported modes and performance targets. Ensure mode registers and ODT settings align with Micron’s recommendations.
• Timing and speed binning: While -107 supports up to DDR3-1866, performance depends on the controller’s capabilities and board layout quality. Apply the datasheet’s tCK and other timing constraints.
• Signal integrity: ODT can improve signal fidelity on longer traces. Validate with simulations and scope measurements during bring-up.
• Thermal design: The industrial rating covers ambient temperature; maintain adequate airflow and consider thermal paths on the PCB to keep the device within its operating range.
• Layout and decoupling: Follow Micron’s board design guidance and your controller vendor’s app notes for ball breakout, length matching, reference planes, and high-frequency decoupling placement.
• Validation: Use memory test suites and stress patterns at temperature extremes (-40°C and +85°C ambient) to verify margin.

Lifecycle, sourcing, and alternates

• Lifecycle status: Not specified in the provided data. For real-time lifecycle position, check Micron’s product page or contact Micron support.
• Availability and pricing: Quotation-based. Lead times and supply vary with market conditions; request a quote with your target speed grade (-107), package (96-ball FBGA), and temperature grade (IT).
• Inventory note: Provided inventory quantity is 0 in this snapshot; engage sourcing early if your build requires firm delivery dates.

Approved alternates guidance
If you must consider alternates, use the following criteria to preserve drop-in compatibility. Verify everything against the system controller and the Micron datasheet before substitution:

• Density and organization: Match 4Gb and x16 (256M x16) exactly.
• Speed grade: Match -107 or ensure your controller and layout can accommodate any timing differences.
• Voltage: Ensure DDR3L 1.35V operation and backward compatibility to 1.5V if required.
• Package: Match 96-ball FBGA and the Micron “TW” ball map to avoid mechanical/PCB mismatches.
• Timing parameters: Confirm tCK, tRCD, tRP, tRAS, refresh rates, and ODT options per the datasheet; even within the same speed bin, verify against your design margins.

Because alternates can introduce subtle timing or mode differences, re-validate at temperature and voltage corners to avoid field issues.

Compliance and standards

• JEDEC: Compliant with JESD79-3 (DDR3/DDR3L). Compliance to this standard ensures interoperability with DDR3/DDR3L memory controllers and common initialization/training flows.
• RoHS: RoHS Compliant (Pb-free). This helps streamline environmental documentation and global shipments subject to hazardous substances regulations.

Resources

• Micron product page: https://www.micron.com/products/dram/ddr3-sdram
• Datasheet (4Gb DDR3L): https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf

Keep the datasheet handy for electrical characteristics, mode register definitions, timing tables, recommended operating conditions, and the detailed ball map for the TW package.

Frequently asked questions (FAQs)

Is the Micron MT41K256M16TW-107 IT:P compatible with 1.5V DDR3 systems?

Yes. As a DDR3L device, it operates at 1.35V and is backward compatible with 1.5V (DDR3) operation per the datasheet limits.

What is the operating temperature range for the Industrial (IT) grade?

Industrial temperature devices operate from -40°C to +85°C ambient.

What data rate does the -107 speed grade support?

The -107 speed bin supports up to DDR3-1866, subject to the timing parameters and conditions in the datasheet.

Does this part support on-die termination (ODT)?

Yes. ODT is supported, which can improve signal integrity when properly configured.

What burst lengths are supported?

Burst length options include 4 and 8.

What package is used for the Micron MT41K256M16TW-107 IT:P?

A 96-ball FBGA package (x16) with Micron package code “TW,” suitable for surface-mount assembly. Refer to the datasheet for the full ball map and mechanical details.

Is this device RoHS compliant?

Yes. It is RoHS Compliant (Pb-free).

Are detailed AC/DC electrical and timing parameters available?

Yes. They are available in the Micron datasheet. Specific values vary by speed bin and revision; always consult the latest documentation.

Is this device automotive-qualified?

Automotive qualification is not specified in the provided data. Use only in applications where industrial qualification is sufficient, or consult Micron for automotive-grade options.

How should I approach selecting an alternate if needed?

Match density (4Gb), organization (x16), speed grade (-107), voltage (DDR3L 1.35V with 1.5V compatibility if required), package (96-ball FBGA with the same ball map), and key timing parameters. Validate thoroughly in your system.

The Micron MT41K256M16TW-107 IT:P provides a strong balance of capacity, bandwidth, and low power for embedded and communications designs needing industrial temperature operation. Its compliance with JESD79-3, support for 1.35V DDR3L with 1.5V backward compatibility, and availability in a compact 96-ball FBGA package make it a practical, low-risk choice for new designs and refreshes. For final configuration and timing, always rely on Micron’s datasheet and application guidance.