MT41K64M16TW-107 IT:J

Micron MT41K64M16TW-107 IT:J – 1Gb DDR3L SDRAM (64M x 16) for Industrial and Embedded Systems

The Micron MT41K64M16TW-107 IT:J is a 1Gb DDR3L SDRAM organized as 64M x 16 and built for low-power, high-throughput memory subsystems. Operating at 1.35V with backward compatibility to 1.5V, the -107 speed grade supports data rates up to 1866 MT/s, making it a strong fit for industrial control, embedded designs, and networking equipment that require reliable DDR3L performance across a wide temperature range.

This device comes in a compact FBGA package suitable for dense boards and high-volume SMT production. With Micron’s DDR3L SDRAM pedigree, the MT41K64M16TW-107 IT:J aligns with JEDEC JESD79-3 standards and offers a predictable path for qualification in long-lived industrial platforms.

Quick highlights

• Brand/manufacturer: Micron Technology, Inc.
• Series/category: DDR3L SDRAM, DRAM Memory ICs
• Density and organization: 1Gb, 64M x 16 (16-bit data bus)
• Speed grade: -107 (up to 1866 MT/s)
• Voltage: 1.35V DDR3L, backward compatible to 1.5V
• Temperature grade: IT (Industrial)
• Package: FBGA (surface mount); provided listing indicates 84-ball
• Compliance: JEDEC JESD79-3; RoHS compliant (per provided data)
• Lifecycle: Active (per Micron)

Where the MT41K64M16TW-107 IT:J fits in your design

Engineers selecting DDR3L devices balance throughput, power, and temperature headroom. The Micron MT41K64M16TW-107 IT:J targets exactly that junction:

• Industrial automation: Deterministic performance for PLCs, HMIs, and motion controllers that must run from -40°C to +85°C.
• Embedded compute modules: A 16-bit DDR3L interface pairs well with SoCs/MPUs that expose a 16-bit DDR3/DDR3L memory controller to minimize pin count while maintaining bandwidth.
• Networking and communications: Routers, gateways, and baseband-adjacent hardware benefit from the 1866 MT/s data rate for packet buffers and protocol stacks.
• Power-conscious consumer or commercial devices: DDR3L’s 1.35V supply contributes to lower overall thermal design and extended battery-backed runtimes.

Part-number decoding and ordering clarity

Understanding Micron’s part code helps sourcing teams align to exactly what engineering qualified:

• MT41K64M16TW: Family and organization. “K” denotes DDR3L. “64M16” indicates 64M x 16 organization (1Gb total). “TW” is the package code.
• -107: Speed grade supporting up to 1866 MT/s.
• IT: Industrial temperature grade.
• :J: Revision/option code.

If your AVL or ERP needs explicit package detail, the provided listing calls out FBGA-84. Always verify ball count and ball map against the Micron datasheet before locking footprints.

Detailed specifications

Core memory and interface

• Memory density: 1Gb
• Organization: 64M x 16
• Interface: DDR3L SDRAM (JEDEC JESD79-3)
• Data rate: Up to 1866 MT/s (speed grade -107)
• Voltage: 1.35V nominal (DDR3L), backward compatible to 1.5V

Package and mechanical

• Package: FBGA (BGA)
• Ball/pin count: 84 balls (per provided listing; confirm in datasheet)
• Mounting: Surface mount

Environmental

• Operating temperature: -40°C to +85°C (Industrial grade)
• RoHS/Environmental: RoHS compliant (per provided data)

Timing and latency

• CAS latency: CL7 (provided data; verify against Micron timing tables for the exact speed bin)

Notes on verification: Some parameters (such as exact ball count, detailed power figures, and certain compliance specifics) were not independently confirmed in Micron primary documents at compilation time. Consult the official Micron datasheet for final design decisions.

Power profile and low-power features

DDR3L’s 1.35V operation reduces active and standby power compared to 1.5V DDR3, and the MT41K64M16TW-107 IT:J includes common low-power modes. Provided consumption figures are below; validate with Micron’s datasheet and your operating profile.

• Idle power: 0.15 W (provided figure)
• Active/transmit power: 0.25 W (provided figure)
• Sleep power: 0.05 W (provided figure)
• Low-power features: 1.35V DDR3L operation, auto self-refresh, power-down modes

Your actual draw depends on controller settings (ODT, drive strength), traffic patterns, bank activation policies, refresh strategy, and temperature. During design, characterize worst-case scenarios—high temperature, maximum refresh rate, and sustained high-activity memory bursts.

Why choose this part versus other DDR3/DDR3L options

• Industrial temperature grade: Qualified from -40°C to +85°C to survive harsh environments without down-binning or derating throughput.
• 16-bit data bus: A good balance between signal-count and bandwidth, often matching low- to mid-pin-count SoC memory interfaces.
• Performance headroom: Up to 1866 MT/s offers margin if your system runs lower (e.g., 800–1600 MT/s) to ease timing closure or reduce power.
• Backward compatibility: Operable at 1.5V for controllers that can’t strictly adhere to DDR3L-only signaling, helping with drop-in into legacy designs. Always consult controller documentation for supported I/O standards.

Design-in considerations

• Signal integrity: DDR3L speeds mandate controlled impedance routing, length matching, and solid reference planes. Use the JEDEC ball map and Micron layout guidance for address/command, control, differential DQS, and DQ byte-lane routing.
• Power rails: Provide clean 1.35V (and any required termination/PLL rails per the datasheet). Budget headroom for transient load during ACT/READ/WRITE bursts and refresh.
• Termination and calibration: Configure on-board or controller-based termination per JEDEC guidance. Confirm ZQ calibration and mode register settings against the Micron datasheet.
• Refresh policy: Industrial-temperature operation increases refresh demands. Ensure the memory controller implements temperature-aware refresh intervals if available.
• Compatibility: Verify your SoC/FPGA memory controller supports DDR3L at the desired data rate and bus width (x16). Confirm address mapping and burst length settings per the Micron part.
• Footprint and assembly: If you are transitioning from a different DDR3L FBGA footprint, compare ball pitch, body size, and ball-out carefully. Re-qualify reflow profiles for industrial temperature margins.

Applications

• Industrial control and automation (PLCs, robotics, HMI)
• Embedded systems (SOMs, edge gateways, smart devices)
• Networking and communications equipment (routers, switches, CPE)
• Power-sensitive consumer/commercial products requiring DDR3L

Compliance and standards

• JEDEC: JESD79-3 (DDR3/DDR3L SDRAM standard)
• RoHS: RoHS compliant (per provided data). If you require regional variants (e.g., RoHS 3/2015/863/EU), confirm via Micron compliance documentation for the exact ordering code.

Lifecycle, continuity, and sourcing

• Lifecycle status: Active (per Micron)
• Replacements: None listed in the provided data
• Inventory position: 0 units on hand in the provided listing context

Sourcing guidance:

• Maintain approved alternates with the same organization (64M x 16), density (1Gb), voltage (1.35V DDR3L with 1.5V compatibility if your design needs it), and a matching or faster speed grade.
• Lock to the exact orderable code MT41K64M16TW-107 IT:J to avoid substitutions that may differ in package, revision, or temperature grade.
• For second sources, compare timing tables, AC/DC characteristics, and mode register definitions carefully; not all DDR3L x16 devices are drop-in compatible at high data rates.

Summary specification snapshot

• MPN: Micron MT41K64M16TW-107 IT:J
• Density/organization: 1Gb, 64M x 16
• Interface: DDR3L SDRAM
• Speed grade: -107 (up to 1866 MT/s)
• Voltage: 1.35V, backward compatible to 1.5V
• Temperature grade: Industrial (-40°C to +85°C)
• Package: FBGA; 84-ball indicated (verify in datasheet)
• Mounting: Surface mount
• Compliance: JEDEC JESD79-3; RoHS compliant (per provided data)
• Lifecycle: Active (per Micron)

Frequently asked questions (FAQs)

• What is the memory organization of the MT41K64M16TW-107 IT:J?
  It is organized as 64M x 16, for a total density of 1Gb.

• What data rate does the -107 speed grade support?
  Up to 1866 MT/s per the provided device information.

• Does this part run at 1.35V only?
  It is a DDR3L device specified at 1.35V and is backward compatible with 1.5V operation (check your controller’s supported I/O levels and timing).

• What temperature range does the IT grade cover?
  -40°C to +85°C operating temperature.

• What is the package and ball count?
  FBGA package; 84-ball is indicated in the provided listing. Confirm ball count and ball map in the Micron datasheet for your PCB footprint.

• Is the device RoHS compliant?
  Listed as RoHS compliant in the provided data. For formal declarations, consult Micron’s compliance documents for the exact ordering code.

• Are specific power numbers available?
  Provided figures are 0.15 W (idle), 0.25 W (active/transmit), and 0.05 W (sleep). Verify against Micron’s datasheet and characterize in your system.

• Are there drop-in replacements?
  None are listed here. When evaluating alternates, match density, organization, speed grade, voltage, package, and temperature rating, then validate timing and mode register settings.

Resources

• Product page: https://www.micron.com/products/dram/ddr3-sdram/part-catalog/mt41k64m16tw-107-it:j
• Datasheet hub (DDR3/DDR3L): https://www.micron.com/products/dram/ddr3-sdram

Important notes

• Some parameters (exact package ball count, detailed power figures, RoHS and lifecycle confirmations) could not be independently verified in Micron primary sources at compilation time. Treat the figures presented here as guidance and defer to the official Micron datasheet and compliance documentation for final specifications.
• To reduce sourcing risk, keep the exact orderable MPN “MT41K64M16TW-107 IT:J” in your AVL and link it to the correct footprint and timing profile in your design database.