MT41K64M16TW-107:J

Micron MT41K64M16TW-107:J — 1Gb (64M x 16) DDR3L SDRAM in 96‑ball FBGA

Summary

The Micron MT41K64M16TW-107:J is a 1Gb DDR3L SDRAM organized as 64M x 16 and delivered in a compact 96‑ball FBGA (TW) package. Designed for mainstream computing, embedded, industrial, and communications equipment, this low‑voltage device operates at a nominal 1.35 V (DDR3L) and is typically backward compatible with 1.5 V DDR3 operation when used within Micron’s specified conditions. As a Micron Technology DDR3L family member, it provides a reliable foundation for cost‑effective, high‑density memory subsystems where power efficiency and board area are at a premium.

Engineers and sourcing teams will appreciate the well‑defined organization, proven manufacturing pedigree, and broad ecosystem support for DDR3/DDR3L, all of which help reduce design risk and simplify procurement.

At‑a‑Glance Specifications

• Brand / Manufacturer: Micron Technology, Inc.
• MPN: MT41K64M16TW-107:J
• Memory type: DDR3L SDRAM
• Density: 1Gb
• Organization: 64M x 16
• Nominal voltage: 1.35 V (DDR3L)
• Backward compatibility: DDR3 1.5 V (verify conditions in Micron datasheet)
• Interface: DDR3
• Speed grade: -107 (exact data rate and timing parameters not specified here; consult datasheet)
• Package: 96‑ball FBGA (Micron code: TW)
• Mounting type: Surface mount
• Pin count: 96
• Category: DRAM Memory

Notes and cautions:

• Detailed timing (tCK, tRCD, tRP, tRAS, etc.), data rate, and temperature grades are not specified in this document; refer to the Micron DDR3L datasheet for the MT41K64M16 family.
• Environmental compliance (e.g., RoHS/REACH) is not specified here. Verify with the latest Micron compliance documentation.

Why choose Micron’s MT41K64M16TW-107:J?

• Proven DDR3L platform: DDR3L continues to serve long‑lived industrial and embedded platforms with strong ecosystem support and stable pricing.
• Low‑voltage operation: 1.35 V nominal operation reduces active and standby power compared with 1.5 V DDR3, helping meet thermal and energy budgets.
• Space‑efficient package: The 96‑ball FBGA (TW) format delivers high density in a compact footprint suitable for space‑constrained PCBs.
• Straightforward capacity planning: 1Gb density and 16‑bit data width make it easy to architect 16‑, 32‑, and 64‑bit memory buses by ganging devices as needed.

Understanding the -107 speed grade

“‑107” is a Micron speed bin identifier for this DDR3L device. It maps to a set of maximum data rates and timing parameters defined in the Micron datasheet. Because exact tCK and other timing values are not listed in the data provided here, confirm the following in the official datasheet before final design sign‑off:

• Maximum supported data rate for the -107 grade
• CAS latency and supported CL/tRCD/tRP combinations
• tRFC, tFAW, tWR, and other timing constraints
• Operating temperature range and derating (if applicable)

Design tip: Always align your memory controller configuration (timing registers and mode registers) to the specific die revision and speed grade. When in doubt, derate to the slowest allowed parameters to protect yield across temperature and voltage corners.

Applications and design scenarios

The MT41K64M16TW-107:J is broadly suitable for:

• Computing systems: Thin clients, small form‑factor PCs, legacy network appliances, and industrial PCs that continue to rely on DDR3/DDR3L.
• Embedded and industrial electronics: PLCs, HMIs, factory robotics, motion controllers, data loggers, and medical instrumentation that value supply stability and extended product life cycles.
• Consumer electronics: Set‑top boxes, smart home hubs, and media players needing cost‑effective DRAM.
• Networking and communications equipment: Gateways, routers, VoIP systems, and wireless infrastructure where established DDR3L controllers are commonplace.

Capacity planning examples:

• 16‑bit bus: One MT41K64M16TW yields 1Gb capacity; suitable for compact designs.
• 32‑bit bus: Use two x16 devices in parallel for 2Gb total.
• 64‑bit bus: Use four x16 devices for 4Gb total. Add ECC with an additional x8 device if the controller supports it.

Package, board design, and routing considerations

• Package: 96‑ball FBGA (TW). Specific ball pitch, dimensions, and mechanical drawings must be obtained from the Micron datasheet/package outline.
• Mounting: Surface mount. Reflow profiles, moisture sensitivity level (MSL), and handling procedures should follow Micron guidance.
• Pinout: The x16 DDR3L pinout includes data (DQ[15:0]), strobes (DQS/DQS#), address/command pins (A, BA, RAS#, CAS#, WE#), control signals (CS#, CKE, ODT, RESET#), differential clocks (CK/CK#), and reference/termination pins. Refer to the exact ball map in the datasheet—do not rely on generic pinouts when laying out the PCB.
• Routing: Use matched‑length routing for differential clocks and DQS pairs. Maintain impedance control and adhere to fly‑by topology requirements where applicable. Place termination resistors as recommended.

Not specified in datasheet (here): Ball pitch, exact package dimensions, MSL, and recommended land pattern. Obtain these from Micron’s official package documentation.

Power, I/O levels, and compatibility

• Nominal supply: 1.35 V (DDR3L). Verify acceptable tolerance and any additional rails (e.g., VREFCA, VTT) in the datasheet.
• Backward compatibility: DDR3L devices are typically compatible with 1.5 V DDR3 operation under specified conditions. Confirm this for MT41K64M16TW-107:J and ensure your power architecture and controller IO levels match the datasheet requirements.
• Termination and reference: On‑die termination (ODT), VREF, and fly‑by routing practices are central to signal integrity for DDR3/DDR3L. Validate controller settings and trace impedances during bring‑up.

Not specified in datasheet (here): Current consumption (active/standby), power‑down modes, tIS/tIH margins, and voltage tolerances. Use the Micron datasheet’s electrical characteristics to size regulators and ensure thermal headroom.

Lifecycle, availability, and replacements

• Lifecycle status: Not specified. Check Micron’s product page or contact Micron for the latest status of MT41K64M16TW-107:J.
• Inventory and lead time: Availability varies by region and distributor. If you have tight schedules, plan for buffer inventory or dual‑source strategies with functionally equivalent parts after validation.
• Form‑fit‑function replacements: None are listed here. For second‑source planning, consider Micron’s other MT41K family members that match density (1Gb), width (x16), speed grade (-107), package (96‑ball FBGA, TW), and timing. Any alternate—Micron or otherwise—must be validated at the system level, especially for timing and initialization sequences.

Not specified in datasheet (here): Official Micron‑recommended replacements or cross‑references. Engage your Micron representative for lifecycle roadmaps and managed transitions.

Compliance and environmental

• RoHS/REACH: Not specified here. Consult Micron’s compliance documentation for the specific ordering code MT41K64M16TW-107:J.
• Halogen content and green status: Not specified here. Verify package materials in Micron’s environmental reports.
• Operating temperature: Not specified here. Confirm commercial/industrial/extended temperature grades and any associated timing derates.

Maintaining compliance traceability:

• Capture the exact ordering code including the speed and any temperature options.
• Archive the Micron certificate of compliance and the latest datasheet revision in your PLM system.

Practical sourcing tips for MT41K64M16TW-107:J

• Lock the exact ordering code: Micron MT41K64M16TW-107:J indicates density (1Gb), width (x16), package (TW FBGA), and speed (-107). Minor suffixes can reflect revisions or packing options—cross‑check before placing POs.
• Validate speed grade across the BOM: Ensure your CPU/SoC memory controller supports the -107 bin at your intended data rate and timings.
• Plan for longevity: If your product has a long field life, engage Micron early for lifecycle insight and consider last‑time‑buy contingencies.
• Keep alternates ready: Even within Micron’s family, subtle timing and electrical differences may exist. Qualify alternates under worst‑case PVT conditions.
• Document test vectors: Save your memory calibration, training parameters, and margin test results so you can rapidly re‑verify if you switch lots or alternates.

Detailed feature list (based on provided data)

• 1Gb DDR3L SDRAM (Micron)
• 64M x 16 organization (x16 data bus width)
• Nominal 1.35 V operation for DDR3L
• Typically backward compatible with 1.5 V DDR3 operation; verify in datasheet
• DDR3 interface compatible with mainstream controllers
• -107 speed grade (exact timing/data rate not provided here)
• 96‑ball FBGA (TW) package, surface‑mount, 96 pins

What’s not specified here (check the datasheet)

To finalize designs and purchasing specs, consult the Micron MT41K64M16 DDR3L datasheet for:

• Timing tables: Supported CAS latencies, data rates, and all AC/DC timing parameters by speed grade
• Operating temperature ranges and derating info
• Power consumption: Active, standby, power‑down, self‑refresh currents
• Package details: Ball pitch, package dimensions, MSL, land pattern, and reflow guidance
• Initialization and mode register programming sequences
• ZQ calibration, ODT values, and VREF/VTT specifications

Frequently asked questions (FAQs)

• Q: What is the density and organization of Micron MT41K64M16TW-107:J?

• A: 1Gb DDR3L SDRAM organized as 64M x 16.

• Q: What package does it use?

• A: A 96‑ball FBGA package designated by Micron as TW.

• Q: What is the nominal operating voltage?

• A: 1.35 V nominal (DDR3L).

• Q: Is it backward compatible with standard 1.5 V DDR3?

• A: DDR3L devices are typically backward compatible with 1.5 V operation. Verify specific limits and conditions for the -107 speed grade in the Micron datasheet.

• Q: What does the -107 speed grade indicate?

• A: It identifies a Micron timing/data‑rate bin. Exact maximum data rate and timing values must be taken from the official datasheet.

• Q: Is RoHS/REACH compliance documented for this exact code?

• A: Not specified here. Check Micron’s compliance documents for MT41K64M16TW-107:J.

• Q: Are drop‑in replacements available?

• A: None are specified here. Any alternate must match density, width, package, and speed grade, and should be validated in your system.

Resources

• Micron DDR3L SDRAM product family page and datasheet: https://www.micron.com/products/dram/ddr3-sdram/ddr3l-sdram

Final takeaway

Micron’s MT41K64M16TW-107:J delivers a balanced combination of capacity, power efficiency, and ecosystem maturity. Its 1Gb density and x16 organization are ideal building blocks for 16‑, 32‑, and 64‑bit memory interfaces in embedded and industrial systems that continue to standardize on DDR3L. While key electrical and timing parameters for the -107 speed grade must be confirmed in the Micron datasheet, the combination of Micron quality, low‑voltage operation, and a compact 96‑ball FBGA package makes this device a dependable choice for cost‑sensitive, volume‑manufactured designs. Validate timing, power, and thermals early, and you’ll have a robust DRAM foundation that minimizes sourcing friction and keeps your build on schedule.