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MT48LC16M16A2P-6A IT:G

Manufacturer

MICRON

Mrf. Part #

MT48LC16M16A2P-6A IT:G

Package

Key Attributes

Datasheet

Products Specifications

Micron MT48LC16M16A2P-6A IT:G — 256Mb SDR SDRAM for Industrial and Embedded Designs

The Micron MT48LC16M16A2P-6A IT:G is a 256Mb (16M x 16) single data rate (SDR) synchronous DRAM that brings dependable, legacy-proven memory technology to modern industrial and embedded platforms. Built on Micron’s MT48LC SDRAM family, this x16‑wide device operates at 3.3V with the -6A speed grade supporting clock frequencies up to 166 MHz (tCK = 6 ns) and CAS latencies of 2 or 3. It integrates four internal banks and a burst-oriented architecture to deliver efficient sequential data access while maintaining predictable timing behavior—attributes that remain essential in telecom, networking, HMI, and long-lifecycle industrial systems.

With an industrial temperature rating (IT: -40°C to +85°C) and a RoHS-compliant, lead-free termination option (:G), the MT48LC16M16A2P-6A IT:G is a strong fit for designs that must balance performance, power, and environmental compliance in a compact 54-pin TSOP II package.

Why engineers and sourcing teams choose this part

  • Proven, stable SDR SDRAM technology suitable for legacy and maintenance programs
  • x16 data bus organization for straightforward integration with MCUs, FPGAs, and ASIC memory controllers that expect a 16-bit interface
  • Industrial temperature support for harsh environments
  • Global brand and documentation support from Micron Technology

Key Features and Benefits

Performance aligned with mature SDR controllers

  • Up to 166 MHz operation at the -6A speed grade (tCK ≥ 6 ns)
  • CAS latencies of 2 or 3 provide flexibility across controllers and timing budgets
  • Four internal banks and burst-oriented access for efficient sequential reads/writes

Reliability across temperature

  • Industrial temperature range: -40°C to +85°C (IT option), supporting designs that operate outdoors, in control cabinets, or on factory floors
  • Micron SDRAM family pedigree for consistent behavior and long-term availability via authorized channels

Integration and compliance

  • 3.3V I/O and core operation (VDD/VDDQ = 3.3V ±0.3V) to match common logic families in legacy and industrial designs
  • 54-pin TSOP II (400 mil body) package for space-efficient, surface-mount assembly
  • RoHS-compliant, lead-free termination (:G) to simplify environmental compliance

Detailed Specifications

  • Brand / Manufacturer: Micron Technology, Inc.
  • Series: MT48LC SDRAM
  • MPN: MT48LC16M16A2P-6A IT:G
  • Category: Memory > SDR SDRAM (Single Data Rate)
  • Memory Density: 256Mb
  • Organization: 16M x 16 (x16 data bus), 4 internal banks
  • Interface Type: SDR SDRAM (single data rate)
  • Speed Grade: -6A (tCK min 6 ns, up to 166 MHz)
  • CAS Latency (CL): 2, 3
  • Supply Voltage: VDD/VDDQ = 3.3V ±0.3V
  • Package: 54-pin TSOP II (400 mil body width)
  • Pin Count: 54
  • Mounting Type: Surface Mount
  • Temperature Range (IT): -40°C to +85°C
  • Lead Finish: Lead-free (:G)
  • Refresh: 8K/64 ms (typical for SDR SDRAM)

Notes:

  • Power consumption details are not specified here; consult the Micron datasheet for IDD currents and power modes.
  • Burst length, drive strength options, and detailed timing parameters (e.g., tRCD, tRP, tRAS) are not specified here and should be verified in the latest datasheet.

Package, Layout, and Design-In Considerations

The MT48LC16M16A2P-6A IT:G comes in a compact 54-pin TSOP II package suited for high-density board layouts common in telecom and industrial controllers. The x16 data width simplifies routing for processors and FPGAs with 16-bit memory interfaces. While specific pinout details are not reproduced here, standard SDRAM design practices apply:

  • Keep clock, command, and address lines length-matched and with controlled impedance to maintain signal integrity at speeds up to 166 MHz.
  • Provide adequate decoupling on VDD and VDDQ pins with a combination of bulk and high-frequency capacitors near the device.
  • Observe Micron recommendations for trace topology and termination as applicable to the target board stack-up and controller IO characteristics.
  • Ensure the memory controller timing configuration matches the selected CAS latency (2 or 3) and adheres to the -6A timing budget across temperature and voltage.

Because this is a mature SDR (not DDR/DDR2/DDR3) device, it integrates cleanly into legacy platforms while offering a predictable upgrade path for maintenance builds and production refreshes that must preserve form, fit, and function.

Applications

  • Networking and telecom systems that continue to rely on SDR SDRAM for deterministic behavior and long service lifetimes
  • Industrial control and automation equipment operating across the -40°C to +85°C temperature range
  • Embedded systems and HMI platforms using MCUs, SoCs, or FPGAs with SDR SDRAM controllers and x16 interfaces
  • Legacy and maintenance designs where SDR technology is required to keep existing products in production without major redesigns

Lifecycle, Availability, and Replacements

  • Lifecycle Status: Not specified in the provided data; consult Micron’s product page for the most current status and longevity guidance.
  • Availability: Subject to market conditions; check authorized distributors or Micron sales for current inventory and lead times.
  • Replacements: No direct replacements are listed here. When evaluating alternates, verify x16 organization, density (256Mb), voltage (3.3V ±0.3V), speed grade (-6A), timing (CL=2/3), package (54-pin TSOP II), and industrial temperature range to ensure form/fit/function equivalence.

Sourcing guidance:

  • Prioritize purchases through authorized distribution to ensure device authenticity and correct termination code (:G) for RoHS compliance.
  • Confirm full MPN—including temperature and termination suffixes—to avoid mismatches between commercial and industrial bins or between leaded and lead-free variants.
  • If your design can support multiple CAS latency settings, consider both CL=2 and CL=3 timing sets to widen sourcing options within the same speed grade when applicable.

Compliance and Environmental

  • RoHS: Compliant; the :G suffix indicates lead-free termination.
  • REACH: Noted in the provided data; for substance disclosures and declarations, refer to Micron’s compliance documentation.
  • Operating Temperature: -40°C to +85°C (IT)

If your project requires documentation for environmental audits (RoHS/REACH), coordinate with Micron or authorized distributors to obtain the latest certificates and material declarations corresponding to MT48LC16M16A2P-6A IT:G.

What the naming means

  • MT48LC16M16A2P: Micron SDR SDRAM family device with x16 organization and four banks
  • -6A: Speed grade with tCK min of 6 ns (supports up to 166 MHz), typically operated with CAS latency of 2 or 3
  • IT: Industrial temperature range (-40°C to +85°C)
  • :G: Lead-free, RoHS-compliant termination

This full part number ensures you’re specifying the correct electrical, environmental, and termination characteristics for your build.

Engineering Checklist for Drop-In Use

  • Data width and density match: x16, 256Mb
  • Voltage rails available: VDD/VDDQ = 3.3V ±0.3V
  • Controller compatibility: SDR SDRAM interface with support for CL=2 or CL=3
  • Speed/timing: Controller must meet -6A timing across PVT (process, voltage, temperature)
  • Layout/package: 54-pin TSOP II footprint and keepouts verified
  • Environmental: Industrial temperature qualification aligned with system requirements
  • Compliance: RoHS documentation aligned with :G termination; REACH documentation as needed

Frequently Asked Questions (FAQs)

Q: What does the -6A speed grade signify?
A: It indicates a minimum clock period (tCK) of 6 ns, supporting operation up to 166 MHz, typically with CAS latencies of 2 or 3.

Q: What does the IT temperature option cover?
A: The industrial temperature range: -40°C to +85°C.

Q: What does the :G suffix indicate?
A: Lead-free, RoHS-compliant termination.

Q: What is the package type for MT48LC16M16A2P-6A IT:G?
A: 54-pin TSOP II (400 mil body width), surface-mount.

Q: What is the device organization?
A: 16M x 16 with four internal banks (x16 data bus).

Q: What supply voltage does it require?
A: VDD/VDDQ = 3.3V ±0.3V.

Q: Is detailed power consumption available here?
A: Not specified here; consult the Micron datasheet for IDD currents and power state details.

Resources

  • Product page: https://www.micron.com/products/dram/sdram/part-catalog/mt48lc16m16a2p-6a-it%3ag
  • Datasheet: https://www.micron.com/products/dram/sdram/part-catalog/mt48lc16m16a2p-6a-it%3ag

If your application demands precise timing margins, power calculations, or board-level signal integrity guidance, use the latest Micron datasheet and application notes for MT48LC SDR SDRAM and validate configurations through controller timing simulations and lab characterization.

Summary

The Micron MT48LC16M16A2P-6A IT:G combines a 256Mb density, x16 organization, 3.3V operation, and up to 166 MHz performance in a compact 54-pin TSOP II package. Its industrial temperature capability and RoHS-compliant termination make it an attractive choice for industrial control, embedded HMI, telecom, and networking systems that rely on stable, mature SDR SDRAM technology. While certain detailed parameters (such as exact IDD currents and secondary timing values) should be confirmed in the datasheet, the information provided here gives engineers and sourcing teams a solid foundation to evaluate fit, ensure compliance, and plan procurement through authorized channels.

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