STM32F750Z8T6

STMicroelectronics STM32F750Z8T6 — ARM Cortex‑M7 MCU, 64 KB Flash, LQFP‑144

The STMicroelectronics STM32F750Z8T6 is a value‑line member of the STM32F7 family built on the ARM Cortex‑M7 core. It targets cost‑optimized systems that still need high core performance (up to 216 MHz), external memory expansion, and a broad set of on‑chip peripherals. With 64 KB of embedded Flash and up to 320 KB of SRAM, the STM32F750Z8T6 is particularly well suited to HMI, control, and embedded applications that store code and assets off‑chip while relying on fast on‑chip SRAM for time‑critical routines.

Engineers evaluating the STM32F750Z8T6 will appreciate its mainstream LQFP‑144 packaging for straightforward assembly, a wide 1.7–3.6 V operating range, and up to 114 general‑purpose I/Os (package dependent). For buyers and sourcing managers, the part’s Active lifecycle status and RoHS compliance (per ST ECOPACK) help reduce qualification risk and simplify environmental compliance.

At‑a‑Glance Features and Specifications

• Manufacturer/Brand: STMicroelectronics
• Series/Family: STM32F7 (STM32F750 Value line)
• MPN: STM32F750Z8T6
• CPU Core: ARM Cortex‑M7
• Architecture: 32‑bit MCU
• Max core frequency: Up to 216 MHz
• Embedded Flash: 64 KB
• On‑chip SRAM: Up to 320 KB
• Supply voltage (VDD): 1.7 V to 3.6 V
• Package: LQFP‑144 (Tray)
• Mounting type: Surface Mount
• Pin count: 144
• GPIO: Up to 114 I/Os (package dependent)
• Environmental/Compliance: RoHS Compliant (per ST ECOPACK specifications)
• Lifecycle status: Active

Notes:

• External memory interfaces are supported (e.g., FMC and Quad‑SPI) for code/data storage in external devices. Refer to the datasheet/reference manual for exact pin availability in LQFP‑144.
• Detailed current consumption figures, peripheral lists, and temperature grades are not specified in the provided data. Consult the official ST documentation for precise values.

What Makes the STM32F750Z8T6 a Strong Fit

The STMicroelectronics STM32F750Z8T6 blends high computational throughput from a Cortex‑M7 core with a lean on‑chip Flash budget. This encourages architectures that keep the time‑critical kernel, bootloader, and performance‑sensitive functions in internal memory while placing assets, GUI resources, or less critical code externally via the device’s supported memory interfaces. The result is a cost‑efficient design that still benefits from the responsiveness and determinism embedded developers expect from the STM32F7 family.

Processing and Memory Strategy

• Cortex‑M7 core up to 216 MHz provides headroom for control loops, signal processing, and responsive user interfaces.
• 64 KB Flash keeps the device cost‑optimized, while up to 320 KB SRAM supports buffers, stacks, and real‑time tasks.
• External memory interfaces (e.g., FMC and Quad‑SPI) enable execution‑in‑place (XIP) use cases and large data/code storage for HMIs and complex middleware, subject to interface and package pin availability.

Electrical and Mechanical Fit

• 1.7–3.6 V VDD range accommodates common embedded supply rails and power architectures.
• LQFP‑144 with up to 114 I/Os (package dependent) provides ample pin count for parallel interfaces, expansion buses, and rich peripheral pin‑muxing.
• Surface‑mount packaging and tray shipment ease manufacturing flow and storage.

Typical Applications

• Industrial control and automation: Deterministic processing and rich I/O help consolidate control, monitoring, and communications in a single MCU platform.
• Human–machine interfaces (HMI): Combine the STM32F750Z8T6 with external Flash/PSRAM/QSPI memories to support GUI assets while keeping real‑time tasks on internal SRAM.
• Consumer and embedded electronics: Benefit from a fast core and scalable memory approach across price points.
• Motor control and drives: Leverage high core speed and available I/O for timers, sensors, and feedback loops (specific peripheral details should be verified in the datasheet for the LQFP‑144 package).
• IoT edge/gateways leveraging external memory: Store protocols, stacks, and logs externally while maintaining fast local processing.

Design Considerations for the STM32F750Z8T6

External Memory Planning

• Interface Selection: The device supports external memory interfaces such as FMC and Quad‑SPI (per ST documentation). Choose external NOR/NAND/PSRAM/HyperRAM solutions consistent with the pinout available on the LQFP‑144 package.
• Code Placement: Keep time‑critical routines in internal SRAM and reserve external memory for larger, less timing‑sensitive sections, GUI assets, and data logging.
• Boot Strategy: Validate boot options and memory mapping in the datasheet/reference manual, including any constraints on XIP and cache/latency considerations noted by ST.

Power and Voltage Domains

• Supply Range: Operates from 1.7–3.6 V on VDD. Some external interfaces or companion PHYs may require their own supply rails. Refer to the datasheet for domain‑specific details.
• Power Profiles: The provided data does not specify current consumption or low‑power modes. Use the official datasheet and power application notes to budget for run, sleep, and stop modes.

Pinout and Peripheral Availability

• GPIO Count: Up to 114 general‑purpose I/Os in LQFP‑144; actual usable count depends on interface selection and multiplexing.
• Peripheral Mapping: Confirm that required interfaces are bonded out in the Z‑package and available concurrently with other selected functions.

Reliability, Compliance, and Lifecycle

• Lifecycle: Active (per the provided data), supporting long‑term sourcing strategies.
• Environmental: RoHS compliant; lead‑free per ST’s ECOPACK specifications.
• Temperature/Qualification: The exact temperature grade for the STM32F750Z8T6 suffix is determined by ST; see the datasheet for the numeric specification. The provided data does not include explicit temperature range values.

Sourcing and Procurement Guidance

• Part Identification: STM32F750Z8T6 — “Z” denotes the LQFP‑144 package, “8” indicates 64 KB Flash, “T” reflects the LQFP package style, and “6” refers to a specific temperature/qualification grade defined by ST.
• Packaging: Supplied in trays. Ensure your inbound logistics and SMT lines are set up for tray handling.
• Compliance Documentation: RoHS compliant per ST ECOPACK; obtain formal compliance certificates from ST if required by your quality system.
• Lifecycle & Risk: Marked Active. Continue to monitor ST’s product page for any lifecycle notices.
• Availability: The provided data does not include pricing or real‑time stock. Plan lead times conservatively and qualify second‑source boards if your build plan requires it. No replacements or approved alternates are specified in the provided data.

Specifications Summary

Core and Performance

• ARM Cortex‑M7, 32‑bit
• Up to 216 MHz maximum core frequency

Memory

• 64 KB embedded Flash
• Up to 320 KB SRAM
• External memory interfaces supported (e.g., FMC and Quad‑SPI) — see datasheet for package‑specific pin availability

I/O and Package

• Package: LQFP‑144 (Tray)
• Pin count: 144
• GPIO: Up to 114 I/Os (package dependent)
• Mounting: Surface Mount

Power

• Supply voltage (VDD): 1.7 V to 3.6 V
• Current consumption and detailed low‑power modes: Not specified in the provided data

Compliance and Lifecycle

• Lifecycle status: Active
• RoHS: Compliant; lead‑free per ST ECOPACK specifications

Application Examples and Integration Notes

• HMI Panels with External Assets: Pair the STMicroelectronics STM32F750Z8T6 with Quad‑SPI NOR for graphics assets and internal SRAM for UI logic and touch processing. Ensure QSPI pins are available in the LQFP‑144 pinout you select.
• Industrial Gateways: Utilize external memory for protocol stacks and buffers while keeping time‑sensitive tasks on‑chip for deterministic performance.
• Motor Control Nodes: Confirm that the timers, PWM outputs, and ADC channels you plan to use are present and pinned out on the Z‑package. Keep fast‑loop code in internal memory for minimal latency.

Lifecycle and Compliance

• Lifecycle: Active (source: STMicroelectronics)
• Replacements: None specified in the provided data
• Approved alternates: None specified
• RoHS: Compliant; lead‑free per ST ECOPACK
• Environmental/Temperature: Not specified in the provided data; consult the STM32F750Z8T6 datasheet

Frequently Asked Questions (FAQs)

Q: What does the suffix Z8T6 indicate for the STM32F750Z8T6?
A: “Z” indicates the LQFP‑144 package; “8” indicates 64 KB Flash; “T” denotes the LQFP package style; “6” corresponds to a specific temperature/qualification grade as defined by ST.

Q: What is the operating supply voltage for the STMicroelectronics STM32F750Z8T6?
A: The VDD operating range is typically 1.7 V to 3.6 V. Some peripheral domains or companion devices may require additional rails. Refer to the datasheet for details.

Q: Does the STM32F750Z8T6 support execution from external memory?
A: Yes. STM32F7 devices provide external memory interfaces (e.g., FMC and Quad‑SPI) for code and data in external memories. Consult the datasheet/reference manual for supported interfaces and package pin availability.

Q: How many GPIOs are available on the STM32F750Z8T6?
A: Up to 114 general‑purpose I/Os are available, subject to pin multiplexing and package constraints in LQFP‑144.

Q: What is the maximum operating frequency of the STM32F750Z8T6?
A: Up to 216 MHz, as specified for the family/value‑line device.

Q: Is the STM32F750Z8T6 RoHS compliant?
A: Yes. It is RoHS compliant and lead‑free per ST’s ECOPACK specifications.

Q: What is the temperature range for the STM32F750Z8T6?
A: Not specified in the provided data. Refer to ST’s datasheet for the exact temperature range associated with the “6” grade.

Q: Are price and stock availability provided here?
A: No. Pricing and real‑time availability are not included in the provided data. Check authorized distributors or ST’s channel partners.

Resources

• Product page: https://www.st.com/en/microcontrollers-microprocessors/stm32f750-value-line.html
• Datasheet: https://www.st.com/resource/en/datasheet/stm32f750x8.pdf

Note: Always verify exact features, memory sizes, electrical specifications, and package pinouts for the STM32F750Z8T6 against the latest STMicroelectronics datasheet and reference manual. Where data is not specified above, consult the official documentation before finalizing your design or procurement.