STM32H750VBT6

STMicroelectronics STM32H750VBT6 – Arm Cortex‑M7 MCU up to 480 MHz, 128 KB Flash, ~1 MB SRAM, LQFP‑100

The STMicroelectronics STM32H750VBT6 is a high‑performance 32‑bit microcontroller in the STM32H7 Value Line, built around an Arm Cortex‑M7 core running up to 480 MHz. It combines 128 KB of embedded Flash with approximately 1 MB of on‑chip SRAM (including TCM) and a rich set of analog and digital peripherals, making it a strong fit for compute‑intensive embedded designs that still need cost control. The VB device comes in a 100‑pin LQFP (14 × 14 mm) package and ships in tray packaging.

• Brand/Manufacturer: STMicroelectronics
• MPN: STM32H750VBT6
• Series: STM32H7 (STM32H750 Value Line)
• Category: Microcontrollers (MCU)
• Package: LQFP‑100, 14 × 14 mm (Tray)
• Mounting: Surface mount (SMT)
• Pin count: 100

Highlights at a glance

• Arm Cortex‑M7, 32‑bit architecture
• Up to 480 MHz max clock
• 128 KB embedded Flash
• ~1 MB on‑chip SRAM (including TCM)
• Industrial temperature grade: −40 to +85 °C
• VDD operating range: 1.62 V to 3.6 V
• Peripheral set includes timers, ADCs/DACs, SPI, I2C, USART/UART, I2S, CAN FD, USB OTG FS/HS, SDMMC, Ethernet MAC, FMC, Quad-/Octo‑SPI (device dependent; consult datasheet for the STM32H750VBT6 feature map)
• FPU (single/double precision) and DSP extensions
• True RNG; crypto peripherals available on selected H7 subfamilies (not specified for STM32H750VBT6)

Overview

The STM32H750VBT6 brings the performance of the STM32H7 platform to applications that prioritize compute throughput and SRAM while keeping on‑chip Flash modest. With a Cortex‑M7 core clocked up to 480 MHz and DSP/FPU accelerations, it addresses demanding real‑time workloads such as motor control loops, audio processing, industrial control, and connected gateways. The part operates from 1.62–3.6 V (VDD), includes multiple power domains, and supports low‑power modes for energy‑sensitive designs.

As a Value Line device, the STM32H750VBT6 balances capability with cost: it integrates 128 KB Flash for boot and essential code, and relies on its sizable on‑chip SRAM (including tightly coupled memories) to execute performance‑critical code and buffers. Where large nonvolatile storage is needed, the H7 family provides external memory interfaces; availability is device dependent, so verify the exact feature set in the STM32H750VBT6 datasheet before committing to a design.

Key specifications

• Core/Architecture: 32‑bit Arm Cortex‑M7
• Maximum clock frequency: Up to 480 MHz
• Embedded Flash: 128 KB
• On‑chip SRAM: ~1 MB (incl. TCM)
• Operating voltage (VDD): 1.62 V to 3.6 V
• Temperature range (industrial): −40 to +85 °C
• Package: LQFP‑100, 14 × 14 mm
• Mounting: Surface mount
• Peripheral classes: Timers, ADCs/DACs, SPI, I2C, USART/UART, I2S, CAN FD, USB OTG FS/HS, SDMMC, Ethernet MAC, FMC, Quad-/Octo‑SPI (device dependent)
• Numeric acceleration: Single/double‑precision FPU; DSP extensions
• Security/Random: True RNG; crypto peripherals on selected H7 subfamilies (not specified for STM32H750VBT6)

Note: Peripheral availability and counts are device dependent. Always confirm exact instances, interfaces, and pins in the STM32H750VBT6 datasheet and reference manual.

Architecture and performance

The STM32H750VBT6 leverages Arm’s Cortex‑M7, a superscalar microcontroller core engineered for high DSP throughput and deterministic real‑time behavior. Key advantages for embedded developers include:

• Dual‑issue pipeline with tightly coupled instruction/data memories (TCM) to minimize latency for critical routines.
• Single‑precision and double‑precision FPU for efficient math in control, filtering, and signal processing applications.
• DSP extensions that accelerate MAC operations, saturating arithmetic, and SIMD‑style data handling.

Running up to 480 MHz, the MCU can meet tight control‑loop deadlines and offload work from external processors in HMI or gateway designs. The balanced memory architecture, with substantial SRAM, suits buffer‑intensive tasks such as Ethernet frames, audio streams, or motor control observers.

Memory and storage strategy

• Embedded Flash: 128 KB is ideal for bootloaders, basic frameworks, or update stubs. For larger applications, you can execute from SRAM after loading code at boot, or leverage external memories.
• On‑chip SRAM: Approximately 1 MB total (including TCM) gives headroom for stacks, heaps, frame buffers, and low‑latency code/data. Partitioning into TCM and general SRAM allows deterministic execution of time‑critical code.
• External memory: The STM32H7 family supports interfaces such as FMC and Quad-/Octo‑SPI for external SRAM/PSRAM, NOR/NAND, or serial flash; availability is device dependent. Verify whether the STM32H750VBT6 variant exposes the interfaces you require.

Design tip: For maximum performance, place ISR hot paths, motor‑control FOC kernels, or audio codecs in TCM. Use external memories for assets and less time‑critical code, factoring in bus and cache behavior. Consult the device datasheet and application notes for memory mapping and wait‑state guidance.

Connectivity and peripherals

The STM32H750VBT6 belongs to a family known for comprehensive connectivity. Based on the provided data, the following classes of peripherals are available in the STM32H7 portfolio and may be present on this device:

• Serial I/O: SPI, I2C, USART/UART, I2S
• Control and timing: Advanced/general‑purpose timers
• Analog: ADCs and DACs
• Industrial and communication: CAN FD
• USB: USB OTG FS/HS
• Storage: SDMMC
• Networking: Ethernet MAC
• External memory interfaces: FMC, Quad‑/Octo‑SPI

Important: Peripheral presence, counts, and pin multiplexing are device dependent. For STM32H750VBT6 specifically, consult the datasheet to confirm which interfaces are included and which pins expose them in LQFP‑100. This is critical when planning Ethernet, USB HS (PHY considerations), or high‑speed memory buses.

Power, clocking, and low‑power modes

• Operating VDD: 1.62 V to 3.6 V.
• Multiple supply rails: The device features separate domains for core and I/O (per family practice); review board‑level decoupling and start‑up sequencing in the datasheet.
• Low‑power features: Sleep/Stop/Standby modes, multiple clock‑gating domains, and the ability to tune performance via PLL configuration. Dynamic voltage/frequency features depend on the regulator and clock tree configuration.

Design tip: For deterministic latency and energy savings, gate unused peripheral clocks and isolate domains not needed in specific operating modes. Validate wake‑up sources and timings in your power budget tests.

Package, pinout, and mechanical

• Package: LQFP‑100 (14 × 14 mm)
• Mounting: Surface mount
• Pin count: 100
• Packaging: Tray (for the STM32H750VBT6 order code). Tape‑and‑reel variants may exist with different suffixes; check distributor listings and ST orderable part numbers.

Board design guidance:

• Follow ST’s reference layouts for high‑speed interfaces (if used), power decoupling, and oscillator routing.
• Reserve pins early for critical functions like debug (SWD/JTAG), external memory, and high‑speed peripherals.
• Confirm alternate‑function mappings in the datasheet for the LQFP‑100 package to avoid pin mux conflicts late in the design.

Applications

• Industrial control and automation
• Motor control and drives
• Consumer and IoT gateways
• Audio and digital signal processing
• Communications and networking (Ethernet, USB)
• HMI and instrumentation

The STM32H750VBT6’s mix of high CPU speed, DSP/FPU capability, and large SRAM makes it a strong candidate wherever real‑time performance and buffering matter more than large on‑chip Flash.

Compliance and environmental

• RoHS status: RoHS compliant
• Package ecology: ECOPACK2/halogen‑free per ST environmental policy (package dependent)
• Automotive qualification: AEC‑Q100 not applicable (standard industrial grade)

If your program requires specific material disclosures or updated environmental files, request the latest ECOPACK documentation and RoHS declarations from ST or authorized distributors.

Lifecycle, sourcing, and availability

• Lifecycle status: Active (mass production)
• Availability: Subject to market conditions; check distributors
• Packaging for this order code: Tray

Sourcing best practices:

• Validate the exact feature set against your interface and memory needs before freezing the BOM; peripheral availability is device dependent.
• Plan for external memory if the 128 KB embedded Flash is insufficient for your application code.
• Keep an eye on package suffixes for logistics (tray vs. tape‑and‑reel) and on potential PCN/PDN notices through ST’s product change notification channels.

Approved alternates and replacements

Within the STM32H7 family, consider the following approved alternates when evaluating memory and security needs. Ensure pinout, package, and peripheral compatibility before substitution.

• STM32H743VIT6: Higher on‑chip Flash (2 MB) and a different package; same STM32H7 family but not pin/package identical.
• STM32H753VIT6: Adds hardware crypto; memory size/package differ. Confirm compatibility.

No direct drop‑in replacements are listed for STM32H750VBT6 in the provided data. If package or pin compatibility is required, search within the LQFP‑100 variants of the H7 family and verify the alternate‑function map.

Design and integration notes

• Software enablement: Leverage STM32CubeHAL, CMSIS‑DSP, and ST’s middleware for a fast bring‑up. Place compute‑critical kernels in TCM for deterministic latency.
• Boot strategy: With 128 KB Flash, consider a compact bootloader that can load application images from external flash into SRAM at boot, if your application exceeds the internal Flash footprint.
• Security and randomness: A true RNG is available per the provided data. Hardware crypto peripherals are present on selected H7 subfamilies; their availability on STM32H750VBT6 is not specified—validate if your design requires on‑chip crypto acceleration.
• Thermal and reliability: The device supports −40 to +85 °C. Ensure adequate power integrity and thermal design at high CPU loads.

Frequently asked questions (FAQs)

Q: Does the STMicroelectronics STM32H750VBT6 include embedded Flash?
A: Yes. It integrates 128 KB of embedded Flash and approximately 1 MB of on‑chip SRAM (including TCM).

Q: What is the operating temperature range for the STM32H750VBT6 (T6 order code)?
A: −40 °C to +85 °C (industrial grade).

Q: What package is the STM32H750VBT6 supplied in?
A: LQFP‑100, 14 × 14 mm, delivered in Tray for this order code.

Q: What is the maximum CPU frequency?
A: Up to 480 MHz.

Q: What is the supply voltage range (VDD)?
A: 1.62 V to 3.6 V.

Q: Does the STM32H750VBT6 include hardware crypto acceleration?
A: Not specified in the provided data for this MPN. Crypto peripherals are available on selected STM32H7 subfamilies—verify in the STM32H750VBT6 datasheet if required.

Q: Is the STM32H750VBT6 RoHS compliant?
A: Yes. It is listed as RoHS compliant. ECOPACK2/halogen‑free package options apply per ST’s environmental policy (package dependent).

Q: Is it automotive qualified?
A: No. AEC‑Q100 is not applicable; this order code is standard industrial grade.

Q: Are peripherals like Ethernet MAC, USB HS, and FMC available on this exact device?
A: Peripheral availability is device dependent. Check the STM32H750VBT6 datasheet and pinout to confirm which interfaces are present in LQFP‑100 and the required external components (for example, external PHY for USB HS if applicable).

Resources

• Datasheet: https://www.st.com/resource/en/datasheet/stm32h750xb.pdf
• Product page: https://www.st.com/en/microcontrollers-microprocessors/stm32h750-value-line.html

Notes: Specifications and feature availability are based on the provided data for STM32H750VBT6 and STM32H7 family documentation. Always verify against the latest STMicroelectronics datasheet and reference manual before design freeze.