STM32H757ZIY6

STMicroelectronics STM32H757ZIY6 – Dual‑core Arm Cortex‑M7/M4 MCU in LQFP‑144

The STMicroelectronics STM32H757ZIY6 is a high‑performance 32‑bit microcontroller that combines a Cortex‑M7 core with a companion Cortex‑M4, delivering scalable performance, advanced connectivity, and robust security features in a 144‑pin LQFP package. It belongs to the STM32H7 series and is designed for demanding embedded applications from industrial control to rich HMI and edge computing.

Quick summary for sourcing and design

STMicroelectronics STM32H757ZIY6 is a dual‑core STM32H7 microcontroller (Arm Cortex‑M7 up to 480 MHz and Cortex‑M4 up to 240 MHz) offered in a surface‑mount LQFP‑144 package, featuring advanced connectivity (USB OTG HS/FS, Ethernet MAC, CAN FD, SDMMC, SPI, I2C, USART/UART) and hardware security features. Refer to the official datasheet for detailed electrical and memory specifications.

Overview

The STM32H757ZIY6 extends the STM32H7 family with a dual‑core architecture that allows developers to partition workloads between a high‑performance Cortex‑M7 and a power‑efficient Cortex‑M4. This approach enables concurrent handling of real‑time control loops, protocol stacks, user interfaces, and signal processing within a single device.

• Brand/manufacturer: STMicroelectronics
• Series: STM32H7
• Category: Microcontrollers (MCU)
• MPN: STM32H757ZIY6
• Package: LQFP‑144 (ZI package option)
• Mounting type: Surface Mount
• Pin count: 144
• Lifecycle status: Active (per STMicroelectronics)
• RoHS: RoHS Compliant

If you are targeting industrial control, motor control, HMI, IoT gateways, or audio applications, the STM32H757ZIY6 provides the compute headroom and peripheral breadth to consolidate multiple functions on one MCU.

Key features and value

• Dual‑core architecture: Arm Cortex‑M7 + Arm Cortex‑M4
• Core frequency: up to 480 MHz (M7) and up to 240 MHz (M4)
• Advanced connectivity: USB OTG HS/FS, Ethernet MAC, CAN FD, SDMMC, SPI, I2C, USART/UART (see datasheet for exact instances and capabilities)
• Hardware security features: on‑chip security building blocks (see datasheet for details)
• 144‑pin LQFP package: broad I/O availability for complex designs
• Surface‑mount integration: suitable for high‑volume and compact PCB layouts

Value for engineers and sourcing teams:

• Consolidate control, communications, and user interface workloads on one device using the dual‑core partitioning.
• Leverage a widely adopted MCU platform within ST’s STM32 portfolio for long‑term ecosystem support.
• RoHS compliance and active lifecycle status streamline approval and reduce risk for production programs.

Architecture and performance

Dual‑core execution model

The Cortex‑M7 core targets compute‑intensive tasks such as signal processing, graphics, or complex control algorithms, while the Cortex‑M4 can manage real‑time peripherals, communication stacks, or housekeeping tasks. This division helps optimize latency and determinism without sacrificing top‑end throughput.

Clocking and core speeds

• Cortex‑M7 up to 480 MHz
• Cortex‑M4 up to 240 MHz

Actual achievable performance depends on clock configuration, wait‑states, and system settings. Refer to the STM32H755/757 datasheet for timing conditions and frequency‑voltage relationships.

Memory and bus architecture

Specific memory sizes (Flash, SRAM, cache, TCM) and bus interconnect details are not specified in this summary. See the official datasheet and reference manual for memory maps, cache/TCM availability, and multi‑bus access considerations.

Package, pinout, and hardware integration

The STM32H757ZIY6 uses the ZI package option, which corresponds to an LQFP‑144 case suitable for standard SMT assembly processes.

• Package: LQFP‑144 (ZI)
• Pin count: 144
• Mounting: Surface Mount

Design considerations:

• Verify pin multiplexing (alternate functions) per the device pinout tables to ensure peripheral routing aligns with your PCB constraints.
• Observe ST’s layout guidelines for high‑speed interfaces such as USB HS/FS, Ethernet, SDMMC, and CAN FD, including impedance control and length matching as appropriate.
• Review power and ground pin distribution carefully; decouple according to the datasheet’s recommendations for stable operation at high core frequencies.
• Mechanical drawings, land patterns, and coplanarity specs should be taken from the package information in the datasheet.

Connectivity and I/O highlights

The STM32H757ZIY6 offers a broad set of serial and networking interfaces. The following list summarizes typical options; consult the datasheet for the exact set of instances and features available on this ordering code:

• USB OTG HS/FS
• Ethernet MAC
• CAN FD
• SDMMC
• SPI
• I2C
• USART/UART

These interfaces enable designs that range from real‑time fieldbus gateways and motor drives to connected HMIs and audio transports. For Ethernet and USB HS implementations, observe requirements for external PHYs or clocking as specified in the datasheet.

Security and safety features

Hardware security features are integrated to help protect firmware and data. The exact capabilities (e.g., cryptographic accelerators, key storage, secure boot) should be confirmed in the datasheet for the STM32H755/757 family. If your application has specific certification needs, plan your threat model and security configuration based on the authoritative documentation.

Typical applications

• Industrial control and automation
• Motor control and power conversion
• Human–machine interfaces (HMI) and embedded HMIs
• IoT gateways and edge computing
• Consumer and professional audio

In these use cases, the dual‑core topology allows one core to maintain deterministic control loops while the other handles user interface, networking stacks, or data processing pipelines.

Compliance and environmental

• RoHS status: RoHS Compliant
• Additional environmental certifications: Not specified in datasheet
• Material declarations and substances of concern: Request a material declaration for the exact ordering code from ST or an authorized distributor if your project requires documentation.

Lifecycle, availability, and sourcing

• Lifecycle status: Active (from STMicroelectronics)
• Supply chain notes: For current lead times and allocation status, check authorized distributors and ST’s product page.
• Pricing: Obtain up‑to‑date pricing from authorized distributors; project volumes and shipment terms can affect unit cost.

Sourcing tips:

• Confirm the exact ordering code (including suffixes like ZI and Y6) to match package, temperature grade, and any other options required by your build. Ordering code suffix meanings are defined in the datasheet and product selector.
• Because the STM32H757ZIY6 is a high‑performance device with many interfaces, ensure that the selected alternate codes or substitutes truly meet your form/fit/function needs before committing to a BOM change.

Development ecosystem and tools

ST supports the STM32H7 family with a mature ecosystem of development tools, firmware libraries, and evaluation hardware. For the STM32H757ZIY6, consult the product page for compatible development boards, middleware, and software enablement. Toolchain, middleware stacks, and example projects significantly accelerate bring‑up and reduce integration risk. Refer to ST’s official resources for the latest toolchain coverage and code examples specific to dual‑core STM32H7 devices.

Specifications at a glance

• Core architecture: Arm Cortex‑M7 + Arm Cortex‑M4 (dual‑core)
• Max core frequency: up to 480 MHz (Cortex‑M7), up to 240 MHz (Cortex‑M4)
• Connectivity (typical): USB OTG HS/FS, Ethernet MAC, CAN FD, SDMMC, SPI, I2C, USART/UART (see datasheet)
• On‑chip security: Hardware security features (see datasheet for details)
• Package: LQFP‑144 (ZI)
• Mounting type: Surface Mount
• Pin count: 144
• Lifecycle status: Active
• RoHS: RoHS Compliant
• Detailed electrical characteristics, memory sizes, and temperature ranges: Not specified in datasheet (consult the official documents)

Replacements and alternatives

If the STM32H757ZIY6 is unavailable, consider other dual‑core STM32H7 devices as potential substitutes, provided they meet your form/fit/function criteria. Examples include STM32H745 or STM32H747 variants. Always:

• Verify pinout, package, and mechanical compatibility
• Check peripheral set differences (e.g., cryptography, memory options)
• Validate clocking, boot configuration, and any security feature changes

Note: The most reliable way to select an alternative is to use ST’s product selector in conjunction with the STM32H755/757 datasheet to compare ordering codes and features.

Design considerations and best practices

• Power integrity: High core frequencies demand careful decoupling. Follow the datasheet’s guidance on capacitor placement and values for each supply rail.
• High‑speed signaling: USB HS, SDMMC, and Ethernet require attention to trace impedance, skew, and reference plane continuity. Include test points and consider SI simulations if your stack‑up changes late in the design.
• Boot and configuration: Dual‑core devices offer multiple boot and startup configurations; ensure the boot mode and core‑to‑core coordination strategy are documented early in firmware design.
• Partitioning strategy: Allocate time‑critical control loops to the core that meets your latency requirements, and budget shared resources (buses, memories, DMA) to minimize contention.

Frequently asked questions (FAQs)

• Q: What is the difference between STM32H755 and STM32H757 devices?
  A: Within the STM32H7 dual‑core family, part‑number variants differ primarily by feature set (e.g., hardware cryptography), memory options, and peripherals. Consult the STM32H755/757 datasheet and reference manual for exact differences.

• Q: What does the ZI package code indicate?
  A: ZI denotes the 144‑pin LQFP package option for STM32H7 devices. Always verify detailed mechanical dimensions in the package information section of the datasheet.

• Q: Is STM32H757ZIY6 RoHS compliant?
  A: STMicroelectronics typically supplies STM32 devices as RoHS compliant. For project documentation, request the material declaration for the exact ordering code from ST or an authorized distributor.

• Q: What are the exact Flash and SRAM sizes available on STM32H757ZIY6?
  A: Not specified in datasheet here. Refer to the STM32H755/757 datasheet for memory configurations associated with the STM32H757 ordering codes.

• Q: What is the operating temperature range for STM32H757ZIY6?
  A: Not specified in datasheet here. Check the ordering code table and electrical characteristics for temperature grades.

• Q: What supply voltage does STM32H757ZIY6 require?
  A: Not specified in datasheet here. See the power supply section of the datasheet for all required rails and tolerances.

• Q: Does the part integrate an Ethernet PHY?
  A: The device includes an Ethernet MAC; PHY requirements and interface options should be confirmed in the datasheet.

Resources

• Product page: https://www.st.com/en/microcontrollers-microprocessors/stm32h755-757.html
• Datasheet: https://www.st.com/resource/en/datasheet/stm32h755-757.pdf

This page focuses on the STMicroelectronics STM32H757ZIY6 to help engineers and sourcing teams quickly assess suitability and plan procurement. For authoritative specifications, design limits, and ordering‑code details, always consult the official ST datasheet and product page.