TLV70033DSER

Texas Instruments TLV70033DSER — 200‑mA, high‑PSRR, low‑IQ 3.3‑V LDO in 6‑WSON (DSE)

The Texas Instruments TLV70033DSER is a fixed 3.3‑V, 200‑mA low‑dropout (LDO) linear regulator that combines high power-supply rejection ratio (PSRR) with low quiescent current (IQ), making it a practical choice for noise‑sensitive and battery‑powered designs. Packaged in a compact 6‑WSON (DSE) footprint and featuring an enable pin for power sequencing, the TLV70033DSER streamlines point‑of‑load regulation for microcontrollers, sensors, and mixed‑signal subsystems.

Engineers appreciate the TLV70033DSER for its straightforward integration: a small, surface‑mount package, fixed 3.3‑V output to reduce configuration overhead, and an enable/shutdown control to simplify system power‑up sequencing and power saving modes. For buyers and sourcing teams, the device’s active lifecycle status and RoHS compliance support long‑term availability planning and environmental requirements.

At‑a‑Glance Specifications

• Brand/Manufacturer: Texas Instruments
• Series: TLV700
• MPN: TLV70033DSER
• Category: PMIC – Linear Regulators (LDO)
• Output Voltage: 3.3 V (fixed)
• Output Current: 200 mA
• PSRR: High (refer to datasheet for frequency‑dependent values)
• Quiescent Current (IQ): Low (refer to datasheet for typical/maximum values)
• Enable/Shutdown: Yes
• Output Type: Fixed
• Operating Temperature Range: −40°C to +125°C
• Package: 6‑WSON (DSE)
• Pin Count: 6
• Mounting Type: Surface Mount
• Packaging: Tape & Reel (TR)
• Lifecycle Status: Active
• RoHS Status: RoHS Compliant

Notes: Numerical values for PSRR, dropout voltage, noise, accuracy, and IQ are orderable‑ and condition‑dependent. See the Texas Instruments datasheet for exact electrical characteristics: https://www.ti.com/lit/ds/symlink/tlv700.pdf

Why choose the TLV70033DSER?

The TLV70033DSER addresses a common set of power challenges in embedded systems:

• Noise sensitivity: High PSRR helps attenuate upstream switching noise, improving the integrity of analog and RF rails and reducing coupling into sensitive MCU ADC references or precision sensors.
• Battery life and standby power: Low IQ reduces idle current draw, supporting longer battery runtime and lower system power in sleep modes.
• Power sequencing and control: The enable pin provides straightforward on/off control for load domains, allowing gated power to peripherals, sensors, or radios only when needed.
• Compact PCB footprint: The 6‑WSON (DSE) package helps shrink power stage area while maintaining robust thermal performance when laid out per TI’s land pattern guidance.

These practical characteristics make the Texas Instruments TLV70033DSER a strong default for 3.3‑V point‑of‑load regulation when simplicity, efficiency at light load, and supply quieting are more important than the absolute lowest dropout or highest output current.

Applications and use cases

The TLV70033DSER is well‑suited to a broad range of embedded and industrial applications, including:

• Point‑of‑load regulation for microcontrollers and sensors: Provide a clean, fixed 3.3‑V rail downstream of a higher‑voltage adapter, USB‑derived 5‑V bus, or a buck converter.
• Battery‑powered and portable devices: Low quiescent current supports long standby time in wearables, IoT end nodes, and handheld instruments.
• Low‑noise analog and RF rails: High PSRR helps isolate PLLs, LNAs, oscillators, precision references, and analog front‑ends from upstream ripple and switching noise.
• General‑purpose 3.3‑V regulation: Suitable as a simple linear post‑regulator or clean‑up stage after a DC/DC converter to further reduce ripple on the 3.3‑V system rail.

Typical design patterns:

• MCU + sensor nodes: Use the enable pin to power‑gate sensor groups for duty‑cycled data acquisition.
• Mixed‑signal boards: Post‑regulate a switching converter with the TLV70033DSER to supply ADC references or codec rails with improved noise performance.
• Radio modules: Isolate transceiver supply rails from digital noise sources while maintaining good light‑load efficiency due to low IQ.

Design‑in considerations

While the TLV70033DSER is easy to deploy, careful attention to a few details ensures robust performance. Always consult the TI datasheet for the most accurate, orderable‑specific requirements.

Input and output capacitors

• Consult the datasheet for the recommended input/output capacitance and ESR ranges. These parameters affect start‑up, stability, and transient response.
• Place the input capacitor close to the IN pin and return it with a short, low‑impedance path to ground. Do the same for the output capacitor and OUT‑to‑GND return.
• Keep the loop area between the input cap, LDO, and output cap as small as possible to minimize inductance and improve high‑frequency PSRR.

Layout and thermal practice

• Follow TI’s land pattern and any exposed‑pad recommendations for the 6‑WSON (DSE) package. If the device variant includes an exposed pad, connect it per the datasheet guidance to improve thermal performance and grounding.
• Use short, wide traces for power pins. Provide local copper area on the output net to reduce impedance and distribute heat.
• Separate noisy switching nodes (from DC/DC converters or clocks) from the LDO input trace whenever practical.

Enable pin usage

• Tie EN high to enable the regulator, or drive it from a GPIO/PMIC for power sequencing. Check logic thresholds and timing in the datasheet.
• For ultra‑low standby current, ensure EN is driven to a defined low level when the rail is not required.

PSRR and noise awareness

• PSRR is frequency‑dependent. Evaluate performance across the frequencies present in your system (e.g., buck switching frequency and harmonics).
• Output capacitor selection and placement influence PSRR at higher frequencies—follow datasheet guidance closely.

Dropout and headroom

• Ensure sufficient input‑to‑output headroom across line, load, and temperature. Dropout voltage is not specified here; consult the datasheet for the TLV70033 orderable to determine the minimum VIN for a regulated 3.3‑V output at your load current.

Sourcing, lifecycle, and availability

• Lifecycle status: Active (per Texas Instruments product page). This supports long‑term design commitments.
• Environmental compliance: RoHS Compliant.
• Packaging: Tape & Reel (TR) for automated assembly.
• Mounting: Surface‑mount 6‑WSON (DSE), 6 pins.
• Inventory note: Inventory quantity provided in this listing is 0 at the time of publication. Availability can vary—check TI and authorized distributors for current stock and lead times.

For purchasing and latest status, refer to:

• Product page: https://www.ti.com/product/TLV700
• Datasheet (family): https://www.ti.com/lit/ds/symlink/tlv700.pdf

Compliance and environmental information

• RoHS: RoHS Compliant
• REACH/halogen status: Not specified
• Moisture sensitivity and ESD classification: Not specified

If your quality system requires specific declarations (e.g., IPC/JEDEC MSL ratings, halogen‑free statements, or full material disclosures), request the latest compliance documents directly from Texas Instruments or your distributor.

Sibling devices and potential alternatives

• TLV700 family coverage: The TLV700 series includes multiple fixed‑output voltages and package options. For alternate voltages or footprints, review TI’s parametric search within the TLV700 family.
• Package‑equivalent options: If a different package is needed, consult TI’s “Order Now”/“Orderable Devices” tables for TLV700 devices that match 3.3‑V output and mechanical constraints.
• Cross‑family considerations: If your design requires different performance trade‑offs (e.g., lower dropout, higher output current, or specific noise metrics), evaluate other Texas Instruments LDO families with similar control features. Always confirm pinout and stability requirements before substitution.

Note: Specific alternate part numbers are not listed here to avoid mis‑matching package or performance attributes. Use the TI product page filters to identify a drop‑in or near drop‑in option.

Practical design checklist

• Define the load profile: Maximum load current, typical load, and dynamic transients up to 200 mA.
• Verify headroom: Ensure VIN exceeds VOUT by the device’s dropout voltage margin at worst‑case conditions (consult datasheet for TLV70033 specifics).
• Choose capacitors per TI guidance: Value, ESR, voltage rating, and temperature characteristics suitable for −40°C to +125°C.
• Plan for enable control: Determine system power‑up/down strategy and GPIO/PMIC control for the EN pin.
• Layout early: Reserve adequate copper for thermal spreading; keep decoupling close; minimize loop area.
• Validate PSRR in‑system: If upstream is a switcher, measure ripple at the loads across operating modes.
• Confirm compliance: RoHS documentation on file; check any additional environmental or regulatory needs.

Specifications summary

• Fixed Output Voltage: 3.3 V
• Maximum Output Current: 200 mA
• PSRR: High (frequency‑dependent; see datasheet)
• Quiescent Current: Low (see datasheet for values)
• Enable Pin: Yes
• Operating Temperature: −40°C to +125°C
• Package / Case: 6‑WSON (DSE)
• Mounting: Surface Mount
• Pin Count: 6
• Packaging: Tape & Reel (TR)
• Lifecycle: Active
• RoHS: Compliant

Parameters not specified here (dropout voltage, output noise, accuracy, start‑up characteristics, thermal resistance, short‑circuit protection, thermal shutdown, etc.) should be obtained from the official TI datasheet for the TLV700 family.

FAQs for Texas Instruments TLV70033DSER

• Q: What is the output voltage of the TLV70033DSER?
  A: 3.3 V fixed.

• Q: How much load current can it supply?
  A: Up to 200 mA.

• Q: Does the Texas Instruments TLV70033DSER include an enable/shutdown pin?
  A: Yes. The enable pin allows on/off control for power sequencing and low‑power modes.

• Q: What package is used?
  A: A compact 6‑WSON (DSE) surface‑mount package with 6 pins.

• Q: What is the operating temperature range?
  A: −40°C to +125°C.

• Q: Is it RoHS compliant?
  A: Yes, RoHS Compliant.

• Q: What is the dropout voltage or typical PSRR value?
  A: Not specified in this summary. Refer to the TI datasheet for the TLV700 family for exact electrical characteristics and curves.

• Q: Are there other fixed‑voltage options in this series?
  A: Yes. The TLV700 series offers multiple fixed‑output voltages. See the TI product page for available options and orderable devices.

• Q: Is this a good choice for noise‑sensitive rails?
  A: Yes. The device is described as having high PSRR and low IQ, making it suitable for noise‑sensitive and battery‑powered applications. Always validate PSRR in your specific system.

Resources

• Texas Instruments Product Page: https://www.ti.com/product/TLV700
• Datasheet (family): https://www.ti.com/lit/ds/symlink/tlv700.pdf

Summary

The Texas Instruments TLV70033DSER is a practical, compact LDO regulator for 3.3‑V rails up to 200 mA, combining high PSRR and low IQ to address noise‑sensitive and battery‑constrained designs. With an enable pin for power sequencing, an industrial temperature range of −40°C to +125°C, and an active lifecycle status, it fits well in embedded control systems, IoT nodes, and mixed‑signal designs that need clean, dependable power without the complexity of a switching regulator. For complete electrical characteristics and detailed guidance on capacitors, dropout voltage, and stability, consult the official TI datasheet and orderable‑specific documentation.