TPS22920YZPR

Texas Instruments TPS22920YZPR – 3.6-V, 4-A, 5.3-mΩ Load Switch with Output Discharge

The Texas Instruments TPS22920YZPR is a compact, low-RON load switch designed to simplify power distribution and load management in space-constrained systems. With a maximum input voltage of 3.6 V, continuous load current up to 4 A, and an integrated quick output discharge (QOD) feature, this device enables clean, controlled power gating for portable electronics, wearables, IoT endpoints, and high-density consumer designs. Housed in an ultra-small 8-ball DSBGA (YZP) package and intended for surface-mount assembly, the TPS22920YZPR balances performance and footprint for modern battery-powered products.

This article summarizes the core value of the TPS22920YZPR for engineers, procurement teams, and sourcing managers, focusing on verified specifications and practical design-in guidance.

At-a-Glance Specifications

• Manufacturer/Brand: Texas Instruments
• MPN: TPS22920YZPR
• Category: Power Switch ICs – Load Switches
• Core function: Load switch with quick output discharge (QOD)
• Max input voltage: 3.6 V
• Continuous load current: 4 A
• Typical on-resistance (RON): 5.3 mΩ (typ)
• Enable logic: Active High
• Operating temperature range: -40°C to +85°C
• Package: DSBGA-8 (TI package code: YZP)
• Packaging: Tape & Reel (suffix “R”)
• Mounting: Surface Mount
• Pin count: 8

Notes:

• RoHS / environmental compliance: Not specified in datasheet
• Lifecycle status: Active (per Texas Instruments product page)

Why Choose the TPS22920YZPR?

The TPS22920YZPR is engineered to minimize voltage drop and power loss in low-voltage rails. Its low 5.3 mΩ (typ) on-resistance supports up to 4 A of load current, making it well-suited for dense systems where efficiency and thermal performance are priorities. The integrated quick output discharge helps ensure that downstream circuitry is safely and quickly de-energized when the switch is disabled, which is especially helpful in multi-rail systems and power-sequencing schemes.

Additionally, the 8-ball DSBGA (YZP) package shrinks the solution to a footprint that is attractive for smartphones, tablets, wearables, and IoT nodes, where every square millimeter counts.

Functional Overview

A load switch like the Texas Instruments TPS22920YZPR sits between a source rail and a downstream load, providing an easy way to enable, disable, and manage that rail under system control.

Key functional elements include:

• Integrated pass element with low RON: Minimizes I·R voltage drop and conduction losses during normal operation.
• Active-high enable input: Allows simple control from a microcontroller or PMIC GPIO to turn the load on and off.
• Quick output discharge (QOD): When disabled, the device provides a discharge path to pull VOUT toward ground, helping to remove residual charge on load capacitance and bringing the downstream rail to a known state.

Because the TPS22920YZPR has a 3.6 V maximum input rating, it is commonly used on rails such as regulated 3.3 V and other sub-3.6 V domains typically derived from a single-cell Li-ion battery or from low-voltage PMIC outputs.

Applications

The TPS22920YZPR is ideal for:

• Portable electronics power gating: Switch individual subsystems on and off to reduce standby power and extend battery life.
• Point-of-load power distribution: Gate power to sensors, radios, and accelerators to manage energy budgets dynamically.
• Wearables and IoT devices: Achieve fine-grained control of multiple rails with minimal area impact.
• Smartphones/tablets and other battery-powered systems: Implement robust power sequencing and controlled shutdowns across high-current rails.

Example usage scenarios:

• Switching a high-current 3.3 V rail to a performance core or co-processor; the low RON reduces voltage droop during bursts.
• Power-gating a sensor array or radio module to eliminate leakage when idle; QOD helps ensure a clean turn-off.
• Creating downstream protection and control for a peripheral bus that must be isolated during system sleep.

Design-In Considerations

Designing with the TPS22920YZPR is straightforward, but attention to a few practical points will yield the best results.

Input Voltage and Headroom

• Maximum VIN is 3.6 V. Keep sufficient margin to account for regulator tolerance and transients on the upstream rail.
• The device is well-matched to common embedded rails such as 3.3 V and other low-voltage domains below 3.6 V.

Current and Losses

• Continuous load current is rated to 4 A. Size the switch with headroom beyond average load, accounting for peak demand, startup surges, and thermal environment.
• Typical RON is 5.3 mΩ. To estimate losses at a representative load:
• At 3 A: Vdrop ≈ 3 A × 5.3 mΩ ≈ 15.9 mV; Pcond ≈ I² × R ≈ 9 × 5.3 mΩ ≈ 47.7 mW.
• At 4 A: Vdrop ≈ 21.2 mV; Pcond ≈ 84.8 mW.
  These are based on the typical RON; actual values vary with conditions.

Quick Output Discharge (QOD)

• QOD provides a discharge path to rapidly pull VOUT low when the switch is disabled. This helps prevent back-powering and leaves the downstream domain in a defined state.
• Consider the total downstream capacitance; larger capacitance will lengthen the discharge time even with QOD present.

Enable Interface

• Active-high enable simplifies control from MCUs and PMICs. Confirm logic-level compatibility with the controller that drives EN.
• If the system requires the rail to default off, use a pull-down on EN; to default on, use a pull-up as appropriate. Choose values that don’t violate leakage and timing requirements.

Layout and Assembly (DSBGA-8, YZP)

• The DSBGA form factor enables an exceptionally small footprint. For reliable assembly:
• Follow TI’s YZP package drawing and land pattern recommendations from the datasheet.
• Maintain clean, controlled solder mask and pad design suitable for fine-pitch micro-bumps.
• Consider via placement and keep-out around the balls to avoid solder wicking; if via-in-pad is used, ensure proper filling and plating per your process control.
• Keep high di/dt paths short and provide adequate local decoupling on VIN relative to the source rail and ground.
• Reflow profile, moisture sensitivity, and handling: Refer to TI packaging documentation and the product label for MSL; do not assume without verification.

Protection and Sequencing

• If your system uses multiple controlled rails, ensure the TPS22920YZPR’s enable timing aligns with peripheral power-on requirements.
• For inrush current control (if needed), manage the downstream capacitance and consider soft-start behavior at the system level. Consult the TI datasheet for any device-specific guidance.

Packaging, Ordering, and Identification

• Orderable part: TPS22920YZPR
• Suffix “YZP”: TI’s 8-ball DSBGA package code
• Suffix “R”: Tape & Reel packaging for automated pick-and-place
• Mounting type: Surface Mount
• Pin count: 8

When specifying the part in a BOM or purchasing system, include the full MPN “TPS22920YZPR” to ensure correct packaging and logistics. If you require other packing options, check TI’s product page for any alternate orderable suffixes.

Lifecycle, Availability, and Sourcing Tips

• Lifecycle status: Active (per Texas Instruments product page).
• Current inventory (this listing): 0 units. If you require immediate supply, consider placing a lead-time order or checking authorized TI distributors.
• Sourcing checklist:
• Confirm MPN and package: TPS22920YZPR, DSBGA-8 (YZP)
• Verify operating temperature range: -40°C to +85°C
• Validate electrical fit: VIN ≤ 3.6 V; ILOAD up to 4 A; RON 5.3 mΩ typ
• Ensure tape-and-reel orientation and quantity match your assembly plan
• Confirm environmental compliance status as required by your program

No direct replacements are specified in the provided data. If you need alternates with different voltage or feature sets, use TI’s parametric search to filter by input voltage, current capability, package, and discharge behavior.

Compliance and Environmental

• RoHS/REACH: Not specified in datasheet. Verify compliance status on the TI product page or compliance portal for your region and documentation needs.
• Operating temperature: -40°C to +85°C
• Additional certifications or material declarations: Not specified

For regulated markets or specific OEM requirements, obtain official compliance certificates directly from Texas Instruments.

Practical Integration Checklist

• Electrical
• VIN within 0–3.6 V
• Load current within 4 A continuous
• Logic-high EN level compatible with your controller
• Consider worst-case RON and thermal rise in your environment
• Layout
• Follow TI YZP land pattern recommendations
• Place decoupling near VIN source; keep return paths short
• Observe keep-outs around micro-bumps; manage vias appropriately
• System behavior
• Verify power-up/down sequencing with QOD effects on downstream rails
• Validate transient behavior with realistic load steps and capacitance
• Confirm startup and shutdown meet peripheral specifications

Frequently Asked Questions (FAQs)

Q: What is the typical on-resistance of the TPS22920?
A: Approximately 5.3 mΩ (typ).

Q: Does the TPS22920 provide quick output discharge (QOD)?
A: Yes, it includes integrated output discharge to quickly pull VOUT low when disabled.

Q: What package is TPS22920YZPR supplied in?
A: 8-ball DSBGA with TI package code YZP (tape-and-reel suffix R).

Q: What is the maximum input voltage the TPS22920YZPR supports?
A: 3.6 V maximum.

Q: What is the continuous load current rating?
A: Up to 4 A.

Q: What is the enable logic polarity?
A: Active High.

Q: What is the operating temperature range?
A: -40°C to +85°C.

Q: Is the device RoHS compliant?
A: Not specified in the datasheet provided here. Check the TI product page for the latest compliance documentation.

Resources

• Texas Instruments product page: https://www.ti.com/product/TPS22920
• Texas Instruments datasheet: https://www.ti.com/lit/ds/symlink/tps22920.pdf

Summary

The Texas Instruments TPS22920YZPR is a capable, space-efficient load switch ideal for modern low-voltage rails up to 3.6 V. With 4 A continuous current support, a low typical RON of 5.3 mΩ, and integrated quick output discharge, it delivers clean power gating for battery-powered and embedded systems. The 8-ball DSBGA (YZP) package and tape-and-reel supply format make it straightforward to integrate into high-volume surface-mount production. For compliance details and any additional ordering options, reference the TI product page and datasheet. This balance of performance, size, and ease of use makes the TPS22920YZPR a strong choice for engineers and sourcing teams seeking a reliable, active lifecycle solution from Texas Instruments.