ULQ2003D1013TRY

STMicroelectronics ULQ2003D1013TRY — 7‑channel 50 V, 500 mA Darlington low‑side driver in SOIC‑16

Summary

The STMicroelectronics ULQ2003D1013TRY is a seven‑channel NPN Darlington transistor array designed for robust low‑side switching of inductive and resistive loads. Belonging to the ULQ2003 series, it integrates clamp diodes tied to a common COM pin, simplifying the drive of relays, solenoids, lamps, and stepper motor phases. Each channel can sink up to 500 mA with output devices rated to 50 V, and the inputs are TTL/CMOS compatible thanks to integral input resistors. The device is offered in a compact SOIC‑16 package for surface‑mount assembly and is supplied in tape‑and‑reel (TR) packaging. The “Y” environmental suffix denotes ECOPACK2 (lead‑free/halogen‑free) compliance.

• Brand / Manufacturer: STMicroelectronics
• Series: ULQ2003
• Category: Darlington Transistor Array (Low‑Side Driver)
• MPN: ULQ2003D1013TRY
• Package: SOIC‑16 (SO‑16), Tape & Reel
• Mounting: Surface‑mount (SMD)
• Pin count: 16

Datasheet → ST ULQ2003 series

Key specifications

• Channels: 7
• Output topology: NPN Darlington, low‑side sink
• Output current (per channel): up to 500 mA max (observe total package power dissipation limits)
• Output voltage rating: 50 V
• Input compatibility: TTL/CMOS with integral input resistors
• Integrated clamp diodes: Yes, diode cathodes tied to COM for inductive loads
• Logic polarity: Active‑high input drives the corresponding output low (sinking current)
• Package: SOIC‑16 (SO‑16), TR
• Environmental: RoHS compliant (ECOPACK2 “Y” variant)

Why designers choose the ULQ2003D1013TRY

• Consolidates seven drivers into one IC, shrinking BOM and PCB area versus discrete transistors and diodes.
• Built‑in clamp diodes simplify inductive load control, reducing external parts and layout complexity.
• TTL/CMOS‑compatible inputs minimize interface overhead when driven from microcontrollers, FPGAs, or logic.
• 50 V output rating and up to 500 mA/channel provide ample headroom for many relays, solenoids, and small motor phases.
• Tape‑and‑reel, ECOPACK2 (lead‑free/halogen‑free) build supports automated assembly and environmental compliance.

Applications and use cases

• Relay and solenoid drivers: Use a channel per coil; connect the coil to the positive supply and the driver sinks current to ground. The COM pin returns clamp current to the supply during coil turn‑off.
• Lamp and LED array drivers: Suitable for incandescent or indicator lamps. For LEDs, include proper external current limiting. The array format makes it practical to control segments or banks.
• Stepper motor phase drivers: The seven low‑side channels and integrated clamp diodes lend themselves to multi‑phase stepper motor arrangements or multiple small DC loads.
• General‑purpose low‑side switching: Any application requiring logic‑controlled sinking of higher voltage/current loads within the 50 V and 500 mA/channel limits.

Functional overview and design notes

• Input stage: Each channel features an input compatible with TTL/CMOS logic levels and includes an integral resistor network, avoiding the need for external base resistors. Drive the input high to turn the corresponding low‑side transistor on.
• Output stage: Each output is an NPN Darlington pair configured as an open‑collector low‑side sink. The load is typically connected between the positive supply and the output pin; the device then sinks current to ground when activated.
• Clamp diodes and COM pin: Integrated clamp diodes protect against inductive kickback. Tie the COM pin to the positive supply used by the loads so the diodes can route flyback energy safely. This reduces voltage stress on the outputs and simplifies EMI considerations.
• Logic polarity: Inputs are active‑high; asserting an input pulls the corresponding output low, enabling current through the load.
• Channel paralleling: Where a single channel’s current capability is insufficient, channels may be paralleled to increase current capacity. Drive the paralleled inputs from the same signal, keep trace lengths similar, and ensure thermal limits are observed. While paralleling can help share load, perfect current balance is not guaranteed; design with margin and consider worst‑case sharing.
• Thermal and power: The 500 mA rating is per channel, but overall dissipation is limited by the package and ambient conditions. Budget power based on duty cycle, load voltage, and the Darlington saturation characteristics. Thermal relief (copper area) and airflow improve headroom.
• External protection: The integrated clamp diodes address inductive turn‑off transients. For highly inductive or noisy environments, additional snubbing or transient suppression across the supply may be beneficial. For non‑inductive, fast‑switched loads, evaluate di/dt and potential ground bounce in the system.

Electrical and timing considerations

• Input drive: Because inputs accept TTL/CMOS levels and include integral resistors, the device can be driven directly from many MCUs and logic devices without external resistors.
• Voltage and current limits: Adhere to the 50 V output rating and 500 mA maximum sink current per channel. Keep in mind total package power dissipation across active channels. If multiple channels conduct simultaneously, ensure the thermal path and copper area can handle the combined loss.
• LED driving: When used with LEDs, incorporate external current‑limiting resistors sized for the LED forward voltage and desired current. The driver provides switching only; it is not a constant‑current regulator.
• Inductive loads: Connect COM to the load supply rail so the integrated diodes clamp voltage spikes appropriately. Verify that the supply and system grounding can absorb the diode return currents without upsetting sensitive circuits.
• Not specified in datasheet (here): Parameters such as propagation delay, saturation voltage at specific currents, and exact thermal metrics are not provided in this summary. Refer to the linked datasheet for detailed electrical characteristics before finalizing the design.

Package, mounting, and ordering information

• Package: SOIC‑16 (SO‑16), 16 pins
• Mounting type: Surface‑mount (SMD)
• Packaging: Tape & Reel (TR)
• Environmental variant: “Y” suffix indicates ECOPACK2 (lead‑free/halogen‑free) build

Notes on naming:

• ULQ2003D1013TRY: The “TR” suffix designates tape‑and‑reel packaging for automated assembly. The “Y” suffix denotes ECOPACK2 compliance. Always check the device marking and ordering information in the datasheet for the exact configuration you intend to source.

PCB layout tips:

• Provide adequate thermal copper under and around the device to help spread heat when multiple channels switch significant current.
• Route the COM pin with a low‑impedance connection to the positive supply used by the inductive loads.
• Keep high‑di/dt paths (load supply, outputs, and ground returns) short and well‑decoupled to minimize EMI.

Lifecycle and compliance

• Lifecycle status: Active (per manufacturer data provided)
• RoHS/Environmental: RoHS compliant; ECOPACK2 “Y” indicates lead‑free/halogen‑free packaging
• Manufacturer/OCM source: STMicroelectronics
• Replacements or pin‑compatible alternatives: Not specified in datasheet

If your design requires a specific qualification (automotive, medical, etc.), verify the part’s suitability and any additional certifications with STMicroelectronics.

Sourcing and availability

• Availability: Subject to market conditions; confirm stock with authorized distributors.
• Inventory snapshot: 0 units indicated in the provided data at the time of writing; lead times and stock can vary.
• Helpful ordering fields: ULQ2003D1013TRY (SOIC‑16, Tape & Reel, ECOPACK2)

Procurement tips:

• Validate that the suffixes match your assembly and environmental requirements (TR for reel, Y for ECOPACK2).
• For current‑intensive builds, consider ordering extra reels to support production ramp and screening for thermal performance.
• Cross‑check date codes and storage recommendations consistent with moisture sensitivity levels for SOIC packages.

Practical design checklist

• Confirm load voltage ≤ 50 V and required current ≤ 500 mA per channel.
• If paralleling channels, verify thermal headroom and current sharing strategy.
• For inductive loads, connect COM to the load supply; evaluate supply rail transient handling.
• For LED/lamp driving, size series resistors or current‑limiting elements appropriately.
• Ensure logic drive levels meet TTL/CMOS thresholds and respect any timing requirements in your system.
• Review the datasheet for detailed electrical limits and recommended operating conditions before release to production.

Frequently asked questions (FAQs)

• What is the maximum current per channel?
  Up to 500 mA sink current per channel, subject to total package power dissipation limits.

• Can channels be paralleled for higher current?
  Yes, adjacent channels can be paralleled to increase current capability. Ensure proper thermal management and consider current sharing.

• What is the COM pin used for?
  COM is the common cathode connection for the internal clamp diodes. Connect it to the positive supply of the inductive load to absorb flyback energy.

• Is this device suitable for driving stepper motors?
  Yes. The seven low‑side drivers and clamp diodes make it suitable for driving stepper motor phases, relays, and other inductive loads.

• Do I need external base/input resistors?
  No. The inputs are TTL/CMOS‑compatible and include integral resistors, so external input resistors are typically unnecessary.

• Is the part RoHS compliant?
  Yes. The “Y” ECOPACK2 suffix indicates a lead‑free/halogen‑free variant.

Resources

• Datasheet: https://www.st.com/resource/en/datasheet/ulq2003a.pdf

If you are integrating the STMicroelectronics ULQ2003D1013TRY into a new design, start with the datasheet for exact electrical characteristics, thermal derating, and ordering information. For sourcing, check authorized distributors for the specific ULQ2003D1013TRY tape‑and‑reel, ECOPACK2 variant to match your assembly needs.