XC7Z045-2FFG676I

AMD Xilinx XC7Z045-2FFG676I | Zynq‑7000 SoC with Dual ARM Cortex‑A9 and 7‑Series Programmable Logic

The AMD Xilinx XC7Z045-2FFG676I brings together a dual-core ARM Cortex-A9 MPCore processing system and 7‑series FPGA programmable logic on a single SoC, delivering high integration for compute- and I/O-intensive embedded designs. As a Zynq‑7000 family device (Z‑7045), this variant features a -2 speed grade, Industrial temperature rating (I), and an FFG676 package (676‑ball FCBGA) suitable for high-density surface-mount designs.

Engineers selecting the XC7Z045-2FFG676I gain the flexibility of Linux-capable ARM application processors tightly coupled to scalable programmable logic, streamlining system consolidation, reducing BOM count, and enabling advanced hardware acceleration.

Key highlights

• Brand/manufacturer: AMD Xilinx (AMD)
• Family: Zynq‑7000 SoC (Z‑7045 device)
• Processing: Dual ARM Cortex‑A9 MPCore, ARMv7‑A with NEON and Thumb‑2
• Programmable logic: Integrated 7‑series FPGA fabric
• Speed grade: -2
• Temperature grade: Industrial (I)
• Package: FFG676 (676‑ball FCBGA), surface mount
• Process technology: 28 nm
• On‑chip memory (OCM): 256 KB
• External memory interfaces: DDR3/DDR3L/LPDDR2
• Lifecycle status: Active
• Environmental: RoHS and REACH compliant

Overview

The AMD Xilinx XC7Z045-2FFG676I is part of the Zynq‑7000 SoC portfolio, combining a dual-core ARM Cortex‑A9 processing system (PS) and 7‑series programmable logic (PL). This heterogeneous architecture enables software-defined functionality on the ARM cores while offloading latency-sensitive, parallel, or high-throughput tasks to the FPGA fabric—ideal for embedded vision, software-defined communications, motor control, and instrumentation.

The XC7Z045 device in the FFG676 package addresses designs that need a large I/O count and a balanced mix of compute and customizable logic in a compact BGA footprint. The -2 speed grade targets designs that benefit from enhanced timing performance compared to lower grades, while the Industrial temperature rating (I) supports deployment in challenging environments where extended operating range is required.

Specifications

Processing system (PS)

• CPU cores: Dual ARM Cortex‑A9 MPCore
• CPU architecture: ARMv7‑A with NEON SIMD and Thumb‑2 support
• On‑chip memory (OCM): 256 KB
• External memory interfaces: DDR3, DDR3L, LPDDR2

Note: Maximum CPU frequency and cache sizes are not specified here; refer to the Zynq‑7000 overview datasheet for device‑specific operating points.

Programmable logic (PL)

• Technology: Integrated AMD Xilinx 7‑series FPGA fabric
• Process: 28 nm

Note: Logic cell count, DSP slice count, and BRAM capacity for the XC7Z045 device are not specified in this document. Consult the official datasheet for detailed resource tables.

Package and mechanical

• Package: FFG676 (676‑ball FCBGA)
• Pin count: 676
• Mounting: Surface mount (BGA reflow)

Environmental and compliance

• Temperature grade: Industrial (I)
• RoHS: RoHS compliant (Pb‑free)
• REACH: REACH compliant

Lifecycle and supply

• Lifecycle status: Active (per AMD/Xilinx)
• Replacements: None listed

Applications

• Industrial automation and control: deterministic motor drives, PLC co‑processing, real‑time networking bridges
• Embedded vision and imaging: pre/post‑processing, image pipeline acceleration, sensor aggregation
• Communications and networking: flexible packet processing, hardware time stamping, and protocol adaptation
• Test and measurement: high-throughput data capture, custom signal conditioning, and streaming to external memory
• Aerospace and defense (non‑automotive grade): rapid prototyping of ruggedized embedded compute with adaptable I/O

The XC7Z045-2FFG676I shines where tight coupling of software and hardware acceleration reduces latency and system complexity—especially when requirements evolve over a product’s lifecycle.

Why choose AMD Xilinx XC7Z045-2FFG676I for your design?

Consolidate heterogeneous workloads

A single device hosts application-class ARM cores alongside programmable logic. Tasks like control loops, sensor fusion, packet inspection, or image transforms can be split between software and custom hardware engines to hit performance targets without a discrete FPGA+processor architecture.

Streamline BOM and board area

By replacing multiple chips with a single SoC FPGA, you can reduce components, power rails, and interconnects—saving board space and simplifying layout and supply management. The FFG676 footprint supports dense I/O escape while maintaining a manufacturable BGA pitch for high-volume builds.

Future‑proof with reconfigurability

The integrated 7‑series PL enables field updates for standards evolution or feature adds, extending product life without a wholesale redesign. This is particularly attractive for communications, vision, and instrumentation markets.

Sourcing and ordering guidance

When specifying the XC7Z045-2FFG676I:

• Confirm the full ordering code: XC7Z045‑2FFG676I
• XC7Z045: Zynq‑7000 device (Z‑7045)
• -2: speed grade
• FFG676: 676‑ball fine‑pitch flip‑chip BGA package
• I: Industrial temperature grade
• Validate the package and ball map against your PCB design; FFG676 offers substantial I/O density.
• Align the speed grade with your timing needs in both PS and PL; -2 supports tighter timing than lower grades.
• Check external memory requirements (DDR3/DDR3L/LPDDR2) against your throughput and power goals.
• Verify RoHS and REACH documentation with your compliance workflow (device is listed as compliant).

Inventory quantity in this dataset is 0; consult authorized AMD/Xilinx distributors or franchised partners for current lead times. If your demand is flexible, consider placing NCNR orders early for alignment with production slots.

Design‑in considerations

Power architecture

Zynq‑7000 devices typically require multiple rails for PS, PL, and I/O banks. While exact rail counts and voltages are device‑specific, plan for:

• Sequencing and monitoring to meet PS/PL power‑up requirements
• Separate supplies for memory interfaces (e.g., DDR3/DDR3L/LPDDR2 I/O)
• Adequate decoupling close to the BGA, with attention to high‑frequency impedance

Specific voltages and tolerances are not included here; use the official datasheet and power design guides for precise values.

Memory subsystem

The XC7Z045-2FFG676I supports DDR3, DDR3L, and LPDDR2. For robust operation:

• Follow AMD/Xilinx layout and timing guidelines for high‑speed DDR routing
• Choose termination and topology based on memory type (point‑to‑point for DDR3/DDR3L is common)
• Validate timing margins using the vendor’s memory interface calibration and characterization flows

High‑density BGA layout

With 676 balls, early pin planning is critical:

• Assign I/O banks to voltage standards and interfaces early in the design
• Budget layers for escape routing and differential pairs
• Incorporate ample test access, boundary‑scan strategy, and design for rework underfill policies if applicable

Thermal and mechanical

Industrial‑grade parts target extended environments. For predictable operation:

• Model junction temperature based on realistic workloads in both PS and PL
• Provide heat‑spreading and airflow paths consistent with enclosure constraints
• Validate solder joint reliability for your PCB stack‑up and assembly process

Compliance and environmental

• RoHS: Pb‑free; RoHS compliant
• REACH: Compliant
• Halogen content and moisture sensitivity level (MSL): Not specified in this dataset; consult the package data for MSL and storage/handling guidance.

Maintain traceability to compliance certificates and lot information per your quality system. For formal documentation, reference AMD/Xilinx compliance pages associated with the Zynq‑7000 line.

Lifecycle and risk management

• Lifecycle status: Active (per AMD/Xilinx)
• Official source: AMD (Xilinx)
• Known replacements or next‑gen drop‑ins: Not listed

Risk‑mitigation tips:

• Align your design with a commonly used package (FFG676 is widely adopted within the family)
• Keep a second source strategy at the board level by abstracting to standard interfaces where possible
• Monitor product change notices (PCNs) to stay ahead of lifecycle updates

Practical use cases

• Embedded vision edge node: Run a Linux application on the dual ARM Cortex‑A9 while accelerating pixel pipelines, feature extraction, or compression in the programmable logic.
• Industrial gateway: Terminate fieldbus or time‑sensitive networking on the PL while the PS hosts higher‑level protocol stacks and edge analytics.
• Portable instrumentation: Use the PL for customizable acquisition front‑ends and the PS for UI, storage, and connectivity, all within a compact BGA footprint.

Frequently asked questions (FAQs)

• What is the processing core in the AMD Xilinx XC7Z045-2FFG676I?

• Dual ARM Cortex‑A9 MPCore, ARMv7‑A with NEON and Thumb‑2.

• Does the XC7Z045-2FFG676I include FPGA fabric?

• Yes. It integrates AMD Xilinx 7‑series programmable logic within the Zynq‑7000 SoC architecture.

• What memory types are supported?

• External memory interfaces include DDR3, DDR3L, and LPDDR2.

• How much on‑chip memory is available?

• 256 KB of on‑chip memory (OCM) is specified.

• What does “-2” indicate in XC7Z045-2FFG676I?

• “-2” is the device speed grade, indicating timing performance tier within the family. Specific frequency limits depend on the implemented design and should be verified against the datasheet and timing analysis.

• What does the “I” at the end of the part number mean?

• Industrial temperature grade. Numerical temperature range is not specified here; refer to the official datasheet for exact limits.

• What is the package for this device?

• FFG676: a 676‑ball flip‑chip fine‑pitch BGA; surface‑mount compatible.

• Is the XC7Z045-2FFG676I RoHS and REACH compliant?

• Yes. It is listed as RoHS compliant (Pb‑free) and REACH compliant.

• Is this device active or obsolete?

• Active, per the provided lifecycle status.

• Are recommended replacements available?

• None are listed in the provided data.

• Where can I find the official datasheet?

• See the links in the Resources section below.

Resources

• Product page: https://www.amd.com/en/products/adaptive-socs-and-fpgas/zynq-7000-soc
• Overview/datasheet (DS190): https://docs.xilinx.com/v/u/en-US/ds190-Zynq-7000-Overview

Always cross‑check your design requirements with the latest AMD/Xilinx documentation and device errata.

Summary and takeaways

The AMD Xilinx XC7Z045-2FFG676I Zynq‑7000 SoC delivers a compelling blend of dual ARM Cortex‑A9 processing and 7‑series programmable logic in a 676‑ball FFG package at a -2 speed grade with Industrial temperature capability. It is well-suited to designs that require deterministic acceleration alongside rich software stacks, including industrial control, embedded vision, communications, and instrumentation. With an active lifecycle and RoHS/REACH compliance, it is an attractive choice for long‑running programs where adaptability and supply chain stability are key.

If you are evaluating the XC7Z045-2FFG676I today, begin with pin planning and memory topology selection, confirm power and thermal budgets, and align sourcing on the exact ordering code to ensure the correct speed, package, and temperature grade for your build. Consult the official AMD/Xilinx resources listed above for complete electrical, timing, and packaging details.